Method for producing resin microparticle aqueous dispersion, and resin microparticle aqueous dispersion and resin microparticles obtained by the same

ABSTRACT

The object of the present invention is to provide a method for producing a resin microparticle aqueous dispersion, which can produce monodisperse resin microparticles, does not cause clogging by a product, does not require a high pressure, and has a high productivity. Thus, provided is a method for producing a resin microparticle aqueous dispersion, wherein a fluid having at least one kind of resin dissolved in a solvent with which a resin is soluble and compatible and a fluid of an aqueous solvent join together in a thin film fluid formed between processing surfaces arranged opposite so as to be able to approach to and separate from each other, at least one of which rotates relative to the other, whereby resin microparticles are obtained in the thin film fluid by way of separation/emulsification.

TECHNICAL FIELD

The present invention relates to a method for producing resinmicroparticle aqueous dispersion, and resin microparticle aqueousdispersion and resin microparticles obtained by this method.

BACKGROUND ART

-   Patent Document 1: JP-A H09-111000-   Patent Document 2: JP-A 2004-225028-   Patent Document 3: JP-A 2002-275272-   Patent Document 4: JP-A 2007-147900-   Patent Document 5: JP-A 2006-183018

In recent years, in the fields of paint, ink, adhesive, and the like,conversion in the composition is taking place from an organic solventtype to an aqueous type in view of such aspects as resource saving,environmental hygiene, pollution-free, and less danger. As the examplesof vehicles used in an aqueous paint composition, there may be mentionedsuch resins as alkyd resin, acrylic resin, polyester resin, polyurethaneresin, and epoxy resin. As the examples of transparent resins usable inoptical applications such as an organic glass and a plastic lens, theremay be mentioned such resins as methacrylic resin, polycarbonate resin,styrene resin, and epoxy resin. An aqueous emulsion formed by dispersingresin microparticles into water can be used in various uses, e.g., forresin particles in cosmetics and toners in electrophotograph, because ofthe spherical shape of the resin particle.

Among them, polyester resins represented by polyethylene terephthalateare excellent in such as mechanical, thermal, and electrical properties,and thus they are widely used in such articles as films, sheets, andbottles for various applications, whereby their demands are expanding.To produce such resin microparticles, as described in Patent Document 1,a method in which a solution containing dissolved resin in an organicsolvent is preliminarily mixed with water and then the obtained mixtureis emulsified with a mechanical energy in a batch-wise manner, is known.As described in Patent Document 2, a method for producing polyesterresin microparticle aqueous dispersion, wherein a swelling materialswollen in an organic solvent having a boiling temperature of below 100°C. with which the polyester resin can be swollen but is insoluble ismixed with an aqueous solvent containing a basic compound therebyneutralizing a part or all of the carboxyl group in the polyester resinby the basic compound while dispersing the swelling material into theaqueous solvent in the state of microparticles, and then the organicsolvent is removed, is known. Further, as described in Patent Document 3and Patent Document 4, a method to produce resin microparticles, whereina molten resin is preliminarily mixed in an aqueous solvent and then amechanical shear force is applied to the mixture thus obtained, isknown.

However, with the methods as mentioned above, it has been difficult toobtain monodisperse and uniform particle diameter and particle sizedistribution, and in addition, raw materials usable for them have beenlimited. Furthermore, when an organic solvent is used, there is anabsolute necessity of a step of solvent-removal after the step ofemulsification/dispersion of the resin, which may be highly probable toresult in complicated process and prolonged time for production. Whenresin microparticles are obtained by applying mechanical shear force tothe molten resin, especially when the resin is molten andemulsified/dispersed in an aqueous solvent, treatment under normalpressure is difficult, whereby treatment under high temperature and highpressure becomes an absolute necessity. Naturally, this leads to a highdanger, and in addition, specification of the equipment is for hightemperature and high pressure, thereby tending to heavy equipment whoseoperation is difficult. Further, when the resin is molten under hightemperature and high pressure, especially in the process in which themolten resin is preliminarily mixed in an aqueous solvent and thenemulsified/dispersed, hydrolysis of the resin often occurs often becauseof long residence time in water at high temperature and application ofmechanical shear force. All of these problems are caused bynonuniformity of the agitation in the reactor. That is, uniformdistribution of concentration and temperature in the reactor isdifficult to be established, and thus a complicated process, a prolongedresidence time at high temperature and high pressure, excessivemechanical energy, a heavy equipment and hydrolysis accompanied by them,and so the like, would be resulted as mentioned above. Such problems maybe solved by conducting the foregoing emulsification/dispersion in amicroreaction field whereby temperature, concentration, and mixing stateare strictly controlled, thereby enabling to accomplish uniformity ofparticle size and unification of reaction product effectively andefficiently.

Described in Patent Document 5, production methods of kinds ofmicroparticles using various microreactors and micromixers are informed.There are many advantages in microreactors and systems thereof, but asthe micro flow path diameter is decreased, a pressure loss is inverselyproportional to the biquadrate of the flow path. That is, such highfeeding pressure is necessary that a pump making possible to feed afluid cannot be available. In the case of a reaction accompanied byseparation, there is a problem that a microwave flow path is blocked byclogging of a flow path with a product or bubbles the reactiongenerates. Further, it is also a problem that since the reactionfundamentally depends on speed of molecular diffusion, a microscopicspace is not effective or applicable to every reaction, and actualattempts of the reaction are required by trial and error, then goodresults are selected. Scaling up has been coped with a method ofincreasing the number of microreactors, that is a numbering-up system,but the number of microreactors which can be comprised is limited toseveral dozen, thus inherently aiming exclusively at products of highvalue. The increase in the number of devices leads to an increase in theabsolute number of failure causes, and when the problem of clogging orthe like actually occurs, it can be very difficult to detect a problemsite such as a failure site.

In view of the above-mentioned, the present invention attempts to obtainresin microparticles in a thin film fluid formed between processingsurfaces arranged opposite so as to be able to approach to and separatefrom each other, at least one of which rotates relative to the other,and has an object to provide a method for producing a resinmicroparticle aqueous dispersion, which can produce resin microparticleshaving monodispersity depending on its purpose owing to high uniformityof temperature in the thin film fluid and of the agitation in thereactor, and does not cause clogging with a product byself-dischargeability, and does not require a high pressure, and has ahigh productivity. An object further is to provide a method forproducing a resin microparticle aqueous dispersion, which can produceuniform resin particles with a low energy and can remove a solvent moreconveniently than by conventional methods. An object further is toprovide a method for producing a resin microparticle aqueous dispersion,which enables to conduct the emulsification/dispersion treatmentcontinuously in a short time, and because of its small holding quantitythe equipment can be downsized thereby securing easy handling and highsafety even when the molten resin is emulsified/dispersed at a hightemperature. An object further is to provide a method for producingresin microparticle aqueous dispersion, which can produce an intendedparticle size distribution without the preliminary mixing, with areduced risk of hydrolysis by a short treatment time, and with lowenergy.

DISCLOSURE OF INVENTION

An aspect of the present invention provides a method for producing aresin microparticle aqueous dispersion, wherein:

at least two fluids are used, wherein

at least one kind of the fluids is a fluid having at least one kind ofresin dissolved in a solvent with which a resin is soluble andcompatible,

at least one kind of fluid other than said fluids is a liquid of anaqueous solvent, and

the respective fluids join together in a thin film fluid formed betweentwo processing surfaces arranged opposite to each other so as to be ableto approach to and separate from each other, at least one of whichrotates relative to the other, whereby resin microparticles are obtainedin the thin film fluid by way of separation.

An aspect of the present invention provides a method for producing aresin microparticle aqueous dispersion, wherein:

at least two fluids are used, wherein

at least one kind of the fluids is a fluid having at least one kind ofresin dissolved in a solvent with which a resin is soluble andcompatible,

at least one kind of fluid other than said fluids is a liquid of anaqueous solvent, and

the respective fluids join together in a thin film fluid formed betweentwo processing surfaces arranged opposite to each other so as to be ableto approach to and separate from each other, at least one of whichrotates relative to the other, whereby resin microparticles are obtainedin the thin film fluid by way of emulsification.

An aspect of the invention provides a method for producing a resinmicroparticle aqueous dispersion, wherein:

at least two fluids are used, wherein

at least one kind of the fluids is a fluid containing at least one kindof resin that is heated and molten,

at least one kind of fluid other than said fluids is a liquid of anaqueous solvent, and

the respective fluids join together in a thin film fluid formed betweentwo processing surfaces arranged opposite to each other so as to be ableto approach to and separate from each other, at least one of whichrotates relative to the other, whereby resin microparticles are obtainedin the thin film fluid by way of emulsification/dispersion.

An aspect of the invention provides the method for producing resinmicroparticle aqueous dispersion, wherein a step of preliminary mixingof resin in an aqueous solvent in the method, before the fluid isintroduced between the processing surfaces, can be omitted.

Here, the foregoing term “preliminary mixing” refers to a preliminarymixing of a resin and an aqueous solvent in such a manner that coarseresin particles become the sate of dispersion though the composition iscompletely the same as the resin microparticle aqueous dispersionobtained by the production method according to the present invention.

An aspect of the invention provides the method for producing a resinmicroparticle aqueous dispersion, wherein the production methodcomprises:

a fluid pressure imparting mechanism for imparting predeterminedpressure to a fluid to be processed,

at least two processing members of a first processing member and asecond processing member, the second processing member being capable ofapproaching to and separating from the first processing member, and

a rotation drive mechanism for rotating the first processing member andthe second processing member relative to each other,

wherein each of the processing members is provided with at least twoprocessing surfaces of a first processing surface and a secondprocessing surface disposed in a position they are faced with eachother,

wherein each of the processing surfaces constitutes part of a sealedflow path through which the fluid under the predetermined pressure ispassed,

wherein two or more fluids to be processed, at least one of whichcontains a reactant, are uniformly mixed and positively reacted betweenthe processing surfaces,

wherein, of the first and second processing members, at least the secondprocessing member is provided with a pressure-receiving surface, and atleast part of the pressure-receiving surface is comprised of the secondprocessing surface,

wherein the pressure-receiving surface receives pressure applied to thefluid by the fluid pressure imparting mechanism thereby generating aforce to move in the direction of separating the second processingsurface from the first processing surface,

wherein the fluid under the predetermined pressure is passed between thefirst and second processing surfaces being capable of approaching to andseparating from each other and rotating relative to each other, wherebythe processed fluid forms a fluid film of predetermined thickness whilepassing between both the processing surfaces; and further comprises:

another introduction path independent of the flow path through which thefluid to be processed under the predetermined pressure is passed, and

at least one opening leading to the separate introduction path and beingarranged in at least either the first processing surface or the secondprocessing surface,

wherein at least one processed fluid sent from the introduction path isintroduced into between the processing surfaces, whereby said thin filmliquid is formed, wherein the resin contained in at least any one of theaforementioned processed fluids and a fluid other than said processedfluids are mixed under uniform stirring in the fluid film to obtainresin microparticles.

An aspect of the invention provides the method for producing a resinmicroparticle aqueous dispersion, wherein the space between theprocessing surfaces is cooled or heated thereby obtaining desired resinparticles.

An aspect of the invention provides the method for producing a resinmicroparticle aqueous dispersion, wherein the separation oremulsification/dispersion is conducted in a container capable ofsecuring a depressurized or vacuum state, to form a depressurized orvacuum state of the secondary side at which the fluid after processingis discharged thereby being capable of removing a solvent in the fluidor a gas generated by way of joining of each of the fluid in the thinfilm fluid and a gas contained in the fluid.

An aspect of the invention provides the method for producing a resinmicroparticle aqueous dispersion, wherein the separation oremulsification/dispersion is conducted in a container capable ofadjusting a temperature, to heat the inside of the container therebyimproving efficiency of the treatments of removing the solvent and thegas.

An aspect of the invention provides the method for producing a resinmicroparticle aqueous dispersion, wherein the separation oremulsification/dispersion is conducted in a container capable ofadjusting a temperature, to cool the processed fluid immediately afterthe fluid is discharged.

An aspect of the invention provides the method for producing a resinmicroparticle aqueous dispersion, wherein the resin is at least one kindof resin selected from styrene resin, olefin resin, acrylic resin,halogen-containing resin, vinyl ester resin or derivatives thereof,polyester resin, polyamide resin, polyurethane resin, poly(thio)etherresin, polycarbonate resin, polysulfone resin, polyimide resin,cellulose ester resin, and epoxy resin.

An aspect of the invention provides the method for producing a resinmicroparticle aqueous dispersion, wherein the resin contains a colorant.

An aspect of the invention provides the method for producing a resinmicroparticle aqueous dispersion, wherein at least one kind of thefluids contains a dispersant like water-soluble resin such assurfactants, polyvinyl alcohol, polyethylene glycol, polyethylene oxide,polyvinyl pyrrolidone, water-soluble acrylic resin, water-solublestyrene resin and cellulose ether resin, and oligosaccharide.

An aspect of the invention provides the method for producing a resinmicroparticle aqueous dispersion, wherein at least one kind of thefluids contains a colorant, an electrification regulator, a releastagent, an external additive, a magnetic carrier, and electricallyconductive powders.

An aspect of the invention provides the method for producing a resinmicroparticle aqueous dispersion, wherein at least one kind of thefluids contain silver nanoparticles.

An aspect of the invention provides the method for producing a resinmicroparticle aqueous dispersion, wherein the volume-average particlesize of the obtained resin microparticles is 1 nm to 10000 nm.

An aspect of the invention provides a resin microparticle aqueousdispersion obtained by the production method.

An aspect of the invention provides resin microparticles obtained by theproduction method.

The present invention produces resin microparticles in a thin film fluidformed between processing surfaces arranged to be opposite to each otherso as to be able to approach to and separate from each other, at leastone of which rotates relative to the other, wherein resin particleshaving an average particle size smaller than that of resinmicroparticles obtained by a usual reaction method can be obtained. Thepresent invention is a preferable method for producing resinmicroparticles, wherein resin microparticles can be obtainedcontinuously and efficiently while coping with production with highproduction efficiency. Depending on a necessary amount of production,the apparatus can grow in size by using general scale-up concept.Further, resin particles can be obtained uniformly with low energy. Inaddition, when the separation or emulsification/dispersion treatment andthe solvent removal treatment are conducted almost simultaneously, thefluid containing the resin microparticles that are emulsified/dispersedbetween the processing surfaces is discharged in the state of mist fromthe processing surfaces thereby increasing surface area of the fluid,resulting in a high efficiency of the solvent removal. Accordingly, theseparation or emulsification/dispersion treatment and the solventremoval treatment can be conducted in a substantially single step in amore convenient manner than conventional methods. Further, theseparation or emulsification/dispersion treatment can be conductedcontinuously in a short time, and because of its small holding quantitythe equipment can be downsized thereby securing easy handling and highsafety even when the molten resin is separated or emulsified/dispersedat a high temperature. In addition, a risk of hydrolysis can be reduceddue to a short treating time, and an intended particle size distributioncan be obtained with low energy.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1(A) is a schematic vertical sectional view showing the concept ofthe apparatus used for carrying out the present invention, FIG. 1(B) isa schematic vertical sectional view showing the concept of anotherembodiment of the apparatus, FIG. 1(C) is a schematic vertical sectionalview showing the concept of still another embodiment of the apparatus,and FIG. 1(D) is a schematic vertical sectional view showing the conceptof still another embodiment of the apparatus.

FIG. 2(A) to FIG. 2(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 3(A) is a schematic bottom view showing an important part of theapparatus shown in FIG. 2(C), FIG. 3(B) is a schematic bottom viewshowing an important part of another embodiment of the apparatus, FIG.3(C) is a schematic bottom view showing an important part of stillanother embodiment of the apparatus, FIG. 3(D) is a schematic bottomview showing the concept of still another embodiment of the apparatus,FIG. 3(E) is a schematic bottom view showing the concept of stillanother embodiment of the apparatus, and FIG. 3(F) is a schematic bottomview showing the concept of still another embodiment of the apparatus.

FIG. 4(A) to FIG. 4(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 5(A) to FIG. 5(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 6(A) to FIG. 6(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 7(A) to FIG. 7(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 8(A) to FIG. 8(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 9(A) to FIG. 9(C) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 10(A) to FIG. 10(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 11(A) and FIG. 11(B) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1, and FIG. 11(C) is a schematic bottom view showing animportant part of the apparatus shown in FIG. 1(A).

FIG. 12(A) is a schematic vertical sectional view showing an importantpart of another embodiment of a pressure-receiving surface in theapparatus shown in FIG. 1(A), and FIG. 12(B) is a schematic verticalsectional view showing an important part of still another embodiment ofthe apparatus.

FIG. 13 is a schematic vertical sectional view showing an important partof another embodiment of a surface-approaching pressure impartingmechanism 4 in the apparatus shown in FIG. 12(A).

FIG. 14 is a schematic vertical sectional view showing an important partof another embodiment of the apparatus shown in FIG. 12(A), which isprovided with a temperature regulating jacket.

FIG. 15 is a schematic vertical sectional view showing an important partof still another embodiment of the surface-approaching pressureimparting mechanism 4 in the apparatus shown in FIG. 12(A).

FIG. 16(A) is a schematic transverse sectional view showing an importantpart of still another embodiment of the apparatus shown in FIG. 12(A),FIG. 16(B), FIG. 16(C) and FIG. 16(E) to FIG. 16(G) are schematictransverse sectional views each showing an important part of stillanother embodiment of the apparatus, and FIG. 16(D) is a partially cutschematic vertical sectional view showing an important part of stillanother embodiment of the apparatus.

FIG. 17 is a schematic vertical sectional view showing an important partof still another embodiment of the apparatus shown in FIG. 12(A).

FIG. 18(A) is a schematic vertical sectional view showing the concept ofstill another embodiment of the apparatus used for carrying out thepresent invention, and FIG. 18(B) is a partially cut explanatory viewshowing an important part of the apparatus.

FIG. 19(A) is a plane view of a first processing member in the apparatusshown in FIG. 18, and FIG. 19(B) is a schematic vertical sectional viewshowing an important part thereof.

FIG. 20(A) is a schematic vertical sectional view showing an importantpart of first and second processing members in the apparatus shown inFIG. 18, and FIG. 20(B) is a schematic vertical sectional view showingan important part of the first and second processing members with aminute gap.

FIG. 21(A) is a plane view of another embodiment of the first processingmember, and FIG. 21(B) is a schematic vertical sectional view showing animportant part thereof.

FIG. 22(A) is a plane view of still another embodiment of the firstprocessing member, and FIG. 22(B) is a schematic vertical sectional viewshowing an important part thereof.

FIG. 23(A) is a plane view of still another embodiment of the firstprocessing member, and FIG. 23(B) is a plane view of still anotherembodiment of the first processing member.

FIG. 24(A), FIG. 24(B) and FIG. 24(C) are diagrams showing embodimentsother than those described above with respect to the method ofseparating a processed material after processing.

FIG. 25 is a schematic vertical sectional view showing outline of theapparatus of the present invention.

FIG. 26(A) is a schematic plane view of the first processing surface inthe apparatus shown in FIG. 25, and FIG. 26(B) is an enlarged viewshowing an important part of the first processing surface in theapparatus shown in FIG. 25.

FIG. 27(A) is a sectional view of the second introduction part, and FIG.27(B) is an enlarged view showing an important part of the processingsurface for explaining the second introduction part.

FIG. 28(A) and FIG. 28(B) are each an enlarged sectional view of animportant part for explaining an inclined surface arranged in theprocessing member.

FIG. 29 is a diagram for explaining a pressure-receiving surfacearranged in the processing member, FIG. 29(A) is a bottom view of thesecond processing member, and FIG. 29(B) is an enlarged sectional viewshowing an important part thereof.

BEST MODE FOR CARRYING OUT THE INVENTION

The present invention relates to a method for producing resinmicroparticles by separation as described in Patent Document 5, or amethod for producing resin microparticles by emulsification in a fluidas described in Patent Document 1, and is characterized in that thefluid is formed into a thin film fluid between two processing surfacesarranged so as to be able to approach to and separate from each other,at least one of which rotates relative to the other, and resinmicroparticles are separated or emulsified/dispersed in the thin filmfluid.

More specifically, at least two kinds of fluids are used, at least onekind of which contains at least one kind of resin, and at least one kindof a fluid other than the above fluid is an aqueous solvent, and each ofsaid fluids join together in a thin film fluid formed between theprocessing surfaces thereby obtaining resin microparticles by separationor emulsification/dispersion in the thin film fluid.

An apparatus of the same principle as described in JP-A 2004-49957 filedby the present applicant, for example, can be used in the method ofuniform stirring and mixing in a thin film fluid formed betweenprocessing surfaces arranged to be opposite to each other so as to beable to approach to and separate from each other, at least one of whichrotates relative to the other.

Hereinafter, the fluid processing apparatus suitable for carrying outthis method is described.

As shown in FIG. 1(A), this apparatus includes opposing first and secondprocessing members 10 and 20, at least one of which rotates to theother. The opposing surfaces of both the processing members 10 and 20serve as processing surfaces 1 and 2 to process a fluid to be processedtherebetween. The first processing member 10 includes a first processingsurface 1, and the second processing member 20 includes a secondprocessing surface 2.

Both the processing surfaces 1 and 2 are connected to a flow path of thefluid to constitute a part of the flow path of the fluid.

Specifically, this apparatus constitutes flow paths of at least twofluids to be processed and joins the flow paths together.

That is, this apparatus is connected to a flow path of a first fluid toform a part of the flow path of the first fluid and simultaneously formsa part of a flow path of a second fluid other than the first fluid. Thisapparatus joins both the flow paths together thereby mixing and reactingboth the fluids between the processing surfaces 1 and 2. In theembodiment shown in FIG. 1(A), each of the flow paths is hermeticallyclosed and made liquid-tight (when the processed fluid is a liquid) orair-tight (when the processed fluid is a gas).

Specifically, this apparatus as shown in FIG. 1(A) includes the firstprocessing member 10, the second processing member 20, a first holder 11for holding the first processing member 10, a second holder 21 forholding the second processing member 20, a surface-approaching pressureimparting mechanism 4, a rotation drive member, a first introductionpart d1, a second introduction part d2, a fluid pressure impartingmechanism p1, a second fluid supply part p2, and a case 3.

Illustration of the rotation drive member is omitted.

At least one of the first processing member 10 and the second processingmember 20 is able to approach to and separate from each other, and theprocessing surfaces 1 and 2 are able to approach to and separate fromeach other.

In this embodiment, the second processing member 20 approaches to andseparates from the first processing member 10. On the contrary, thefirst processing member 10 may approach to and separate from the secondprocessing member 20, or both the processing members 10 and 20 mayapproach to and separate from each other.

The second processing member 20 is disposed over the first processingmember 10, and the lower surface of the second processing member 20serves as the second processing surface 2, and the upper surface of thefirst processing member 10 serves as the first processing surface 1.

As shown in FIG. 1(A), the first processing member 10 and the secondprocessing member 20 in this embodiment are circular bodies, that is,rings. Hereinafter, the first processing member 10 is referred to as afirst ring 10, and the second processing member 20 as a second ring 20.

Both the rings 10 and 20 in this embodiment are metallic members having,at one end, a mirror-polished surface, respectively, and theirmirror-polished surfaces are referred to as the first processing surface1 and the second processing surface 2, respectively. That is, the uppersurface of the first ring 10 is mirror-polished as the first processingsurface 1, and the lower surface of the second ring 20 ismirror-polished as the second processing surface 2.

At least one of the holders can rotate relative to the other holder bythe rotation drive member. In FIG. 1(A), numerical 50 indicates a rotaryshaft of the rotation drive member. The rotation drive member may use anelectric motor. By the rotation drive member, the processing surface ofone ring can rotate relative to the processing surface of the otherring.

In this embodiment, the first holder 11 receives drive power on therotary shaft 50 from the rotation drive member and rotates relative tothe second holder 21, whereby the first ring 10 integrated with thefirst holder 11 rotates relative to the second ring 20. Inside the firstring 10, the rotary shaft 50 is disposed in the first holder 11 so as tobe concentric, in a plane, with the center of the circular first ring10.

The first ring 10 rotates centering on the shaft center of the ring 10.The shaft center (not shown) is a virtual line referring to the centralline of the ring 10.

In this embodiment as described above, the first holder 11 holds thefirst ring 10 such that the first processing surface 1 of the first ring10 is directed upward, and the second holder 21 holds the second ring 20such that the second processing surface 2 of the second ring 20 isdirected downward.

Specifically, the first and second holders 11 and 21 include aring-accepting concave part, respectively. In this embodiment, the firstring 10 is fitted in the ring-accepting part of the first holder 11, andthe first ring 10 is fixed in the ring-accepting part so as not to risefrom, and set in, the ring-accepting part of the first holder 11.

That is, the first processing surface 1 is exposed from the first holder11 and faces the second holder 21.

Examples of the material for the first ring 10 include metal, ceramics,sintered metal, abrasion-resistant steel, metal subjected to hardeningtreatment, and rigid materials subjected to lining, coating or plating.The first processing member 10 is preferably formed of a lightweightmaterial for rotation. A material for the second ring 20 may be the sameas that for the first ring 10.

The ring-accepting part 41 arranged in the second holder 21 accepts theprocessing surface 2 of the second ring 20 such that the processingmember can rise and set.

The ring-accepting part 41 of the second holder 21 is a concave portionfor mainly accepting that side of the second ring 20 opposite to theprocessing surface 2, and this concave portion is a groove which hasbeen formed into a circle when viewed in a plane.

The ring-accepting part 41 is formed to be larger in size than thesecond ring 20 so as to accept the second ring 20 with sufficientclearance between itself and the second ring 20.

By this clearance, the second ring 20 in the ring-accepting part 41 canbe displaced not only in the axial direction of the circularring-accepting part 41 but also in a direction perpendicular to theaxial direction. In other words, the second ring 20 can, by thisclearance, be displaced relative to the ring-accepting part 41 to makethe central line of the ring 20 unparallel to the axial direction of thering-accepting part 41.

Hereinafter, that portion of the second holder 21 which is surrounded bythe second ring 20 is referred to as a central portion 22.

In other words, the second ring 20 is displaceably accepted within thering-accepting part 41 not only in the thrust direction of thering-accepting part 41, that is, in the direction in which the ring 20rises from and sets in the part 41, but also in the decenteringdirection of the ring 20 from the center of the ring-accepting part 41.Further, the second ring 20 is accepted in the ring-accepting part 41such that the ring 20 can be displaced (i.e. run-out) to vary the widthbetween itself upon rising or setting and the ring-accepting part 41, ateach position in the circumferential direction of the ring 20.

The second ring 20, while maintaining the degree of its move in theabove three directions, that is, the axial direction, decenteringdirection and run-out direction of the second ring 20 relative to thering-accepting part 41, is held on the second holder 21 so as not tofollow the rotation of the first ring 10. For this purpose, suitableunevenness (not shown) for regulating rotation in the circumferentialdirection of the ring-accepting part 41 may be arranged both in thering-accepting part 41 and in the second ring 20. However, theunevenness should not deteriorate displacement in the degree of its movein the three directions.

The surface-approaching pressure imparting mechanism 4 supplies theprocessing members with force exerted in the direction of approachingthe first processing surface 1 and the second processing surface 2 eachother. In this embodiment, the surface-approaching pressure impartingmechanism 4 is disposed in the second holder 21 and biases the secondring 20 toward the first ring 10.

The surface-approaching pressure imparting mechanism 4 uniformly biaseseach position in the circumferential direction of the second ring 20,that is, each position of the processing surface 2, toward the firstring 10. A specific structure of the surface-approaching pressureimparting mechanism 4 will be described later.

As shown in FIG. 1(A), the case 3 is arranged outside the outercircumferential surfaces of both the rings 10 and 20, and accepts aproduct formed between the processing surfaces 1 and 2 and discharged tothe outside of both the rings 10 and 20. As shown in FIG. 1(A), the case3 is a liquid-tight container for accepting the first holder 11 and thesecond holder 21. However, the second holder 21 may be that which as apart of the case, is integrally formed with the case 3.

As described above, the second holder 21 whether formed as a part of thecase 3 or formed separately from the case 3 is not movable so as toinfluence the distance between both the rings 10 and 20, that is, thedistance between the processing surfaces 1 and 2. In other words, thesecond holder 21 does not influence the distance between the processingsurfaces 1 and 2.

The case 3 is provided with an outlet 32 for discharging a product tothe outside of the case 3.

The first introduction part d1 supplies a first fluid to be processed tothe space between the processing surfaces 1 and 2.

The fluid pressure imparting mechanism p1 is connected directly orindirectly to the first introduction part d1 to impart fluid pressure tothe first fluid. A compressor or a pump can be used in the fluidpressure imparting mechanism p1.

In this embodiment, the first introduction part d1 is a fluid patharranged inside the central part 22 of the second holder 21, and one endof the first introduction part d1 is open at the central position of acircle, when viewed in a plane, of the second ring 20 on the secondholder 21. The other end of the first introduction part d1 is connectedto the fluid pressure imparting mechanism p1 outside the second holder21, that is, outside the case 3.

The second introduction part d2 supplies a second fluid to be reactedwith the first fluid to the space between the processing surfaces 1 and2. In this embodiment, the second introduction part is a fluid passagearranged inside the second ring 20, and one end of the secondintroduction part is open at the side of the second processing surface2, and a second fluid-feeding part p2 is connected to the other end.

A compressor or a pump can be used in the second fluid-feeding part p2.

The first processed fluid pressurized with the fluid pressure impartingmechanism p1 is introduced from the first introduction part d1 to thespace between the rings 10 and 20 and will pass through the spacebetween the first processing surface 1 and the second processing surface2 to the outside of the rings 10 and 20.

At this time, the second ring 20 receiving the supply pressure of thefirst fluid stands against the bias of the surface-approaching pressureimparting mechanism 4, thereby receding from the first ring 10 andmaking a minute space between the processing surfaces. The space betweenboth the processing surfaces 1 and 2 by approach and separation of thesurfaces 1 and 2 will be described in detail later.

A second fluid is supplied from the second introduction part d2 to thespace between the processing surfaces 1 and 2, flows into the firstfluid, and is subjected to a reaction promoted by rotation of theprocessing surface. Then, a reaction product formed by the reaction ofboth the fluids is discharged from the space between the processingsurfaces 1 and 2 to the outside of the rings 10 and 20. The reactionproduct discharged to the outside of the rings 10 and 20 is dischargedfinally through the outlet of the case to the outside of the case.

The mixing and reaction of the processed fluid are effected between thefirst processing surface 1 and the second processing surface 2 byrotation, relative to the second processing member 20, of the firstprocessing member 10 with the drive member.

Between the first and second processing surfaces 1 and 2, a regiondownstream from an opening m2 of the second introduction part d2 servesas a reaction chamber where the first and second processed fluids arereacted with each other. Specifically, as shown in FIG. 11(C)illustrating a bottom face of the second ring 20, a region H shown byoblique lines, outside the second opening m2 of the second introductionpart in the radial direction r1 of the second ring 20, serves as theprocessing chamber, that is, the reaction chamber. Accordingly, thisreaction chamber is located downstream from the openings m1 and m2 ofthe first introduction part d1 and the second introduction part d2between the processing surfaces 1 and 2.

The first fluid introduced from the first opening m1 through a spaceinside the ring into the space between the processing surfaces 1 and 2,and the second fluid introduced from the second opening m2 into thespace between the processing surfaces 1 and 2, are mixed with each otherin the region H serving as the reaction chamber, and both the processedfluids are reacted with each other. The fluid will, upon receivingsupply pressure from the fluid pressure imparting mechanism p1, movethrough the minute space between the processing surfaces 1 and 2 to theoutside of the rings, but because of rotation of the first ring 10, thefluid mixed in the reaction region H does not move linearly from theinside to the outside of the rings in the radial direction, but movesfrom the inside to the outside of the ring spirally around the rotaryshaft of the ring when the processing surfaces are viewed in a plane. Inthe region H where the fluids are thus mixed and reacted, the fluids canmove spirally from inside to outside to secure a zone necessary forsufficient reaction in the minute space between the processing surfaces1 and 2, thereby promoting their uniform reaction.

The product formed by the reaction becomes a uniform reaction product inthe minute space between the first processing surface 1 and the secondprocessing surface 2 and appears as microparticles particularly in thecase of crystallization or separation.

By the balance among at least the supply pressure applied by the fluidpressure imparting mechanism p1, the bias of the surface-approachingpressure imparting mechanism 4, and the centrifugal force resulting fromrotation of the ring, the distance between the processing surfaces 1 and2 can be balanced to attain a preferable minute space, and further theprocessed fluid receiving the supply pressure applied by the fluidpressure imparting mechanism p1 and the centrifugal force by rotation ofthe ring moves spirally in the minute space between the processingsurfaces 1 and 2, so that their reaction is promoted.

The reaction is forcedly effected by the supply pressure applied by thefluid pressure imparting mechanism p1 and the rotation of the ring. Thatis, the reaction occurs under forced uniform mixing between theprocessing surfaces 1 and 2 arranged opposite to each other so as to beable to approach to and separate from each other, at least one of whichrotates relative to the other.

Accordingly, the crystallization and separation of the product formed bythe reaction can be regulated by relatively easily controllable methodssuch as regulation of supply pressure applied by the fluid pressureimparting mechanism p1 and regulation of the rotating speed of the ring,that is, the number of revolutions of the ring.

As described above, this processing apparatus is excellent in that thespace between the processing surfaces 1 and 2, which can exert influenceon the size of a product, and the distance in which the processed fluidmoves in the reaction region H, which can exert influence on productionof a uniform product, can be regulated by the supply pressure and thecentrifugal force.

The reaction processing gives not only deposit of the product but alsoliquids.

The rotary shaft 50 is not limited to the vertically arranged one andmay be arranged in the horizontal direction or arranged at a slant. Thisis because during processing, the reaction occurs in such a minute spacebetween the processing surfaces 1 and 2 that the influence of gravitycan be substantially eliminated.

In FIG. 1(A), the first introduction part d1 extends vertically andcoincides with the shaft center of the second ring 20 in the secondholder 21. However, the first introduction part d1 is not limited to theone having a center coinciding with the shaft center of the second ring20 and may be arranged in other positions in the central portion 22 ofthe second holder 21 as long as the first fluid can be supplied into thespace surrounded by the rings 10 and 20, and the first introduction partd1 may extend obliquely as well as vertically.

A more preferable embodiment of the apparatus is shown in FIG. 12(A). Asshown in this figure, the second processing member 20 has the secondprocessing surface 2 and a pressure-receiving surface 23 which ispositioned inside, and situated next to, the second processing surface2. Hereinafter, the pressure-receiving surface 23 is also referred to asa separation-regulating surface 23. As shown in the figure, theseparation-regulating surface 23 is an inclined surface.

As described above, the ring-accepting part 41 is formed in the bottom(i.e. a lower part) of the second holder 21, and the second processingmember 20 is accepted in the ring-accepting part 41. The secondprocessing member 20 is held by the second holder 21 so as not to berotated with a baffle (not shown). The second processing surface 2 isexposed from the second holder 21.

In this embodiment, a material to be processed is introduced inside thefirst processing member 10 and the second processing member 20 betweenthe processing surfaces 1 and 2, and the processed material isdischarged to the outside of the first processing member 10 and thesecond processing member 20.

The surface-approaching pressure imparting mechanism 4 presses bypressure the second processing surface 2 against the first processingsurface 1 to make them contacted with or close to each other, andgenerates a thin film fluid of predetermined thickness by the balancebetween the surface-approaching pressure and the force, e.g. fluidpressure, of separating the processing surfaces 1 and 2 from each other.In other words, the distance between the processing surfaces 1 and 2 iskept in a predetermined minute space by the balance between the forces.

Specifically, the surface-approaching pressure imparting mechanism 4 inthis embodiment is comprised of the ring-accepting part 41, aspring-accepting part 42 arranged in the depth of the ring-acceptingpart 41, that is, in the deepest part of the ring-accepting part 41, aspring 43, and an air introduction part 44.

However, the surface-approaching pressure imparting mechanism 4 may bethe one including at least one member selected from the ring-acceptingpart 41, the spring-accepting part 42, the spring 43, and the airintroduction part 44.

The ring-accepting part 41 has the second processing member 20 fit intoit with play to enable the second processing member 20 to be displacedvertically deeply or shallowly, that is, vertically in thering-accepting part 41.

One end of the spring 43 is abutted against the depth of thespring-accepting part 42, and the other end of the spring 43 is abuttedagainst the front (i.e., the upper part) of the second processing member20 in the ring-accepting part 41. In FIG. 1, only one spring 43 isshown, but a plurality of springs 43 are preferably used to pressvarious parts of the second processing member 20. This is because as thenumber of springs 43 increases, pressing pressure can be given moreuniformly to the second processing member 20. Accordingly, several to afew dozen springs 43 comprising a multi-spring type preferably attach tothe second holder 21.

In this embodiment, air can be introduced through the air introductionpart 44 into the ring-accepting part 41. By such introduction of air,air pressure together with pressure by the spring 43 can be given aspressing pressure from the space, as a pressurizing chamber, between thering-accepting part 41 and the second processing member 20 to the secondprocessing member 20. Accordingly, adjusting the pressure of airintroduced through the air introduction part 44 can regulate thesurface-approaching pressure of the second processing surface 2 towardthe first processing surface 1 during operation. A mechanism ofgenerating pressing pressure with another fluid pressure such as oilpressure can be utilized in place of the air introduction part 44utilizing air pressure.

The surface-approaching pressure imparting mechanism 4 not only suppliesand regulates a part of the pressing pressure, that is, thesurface-approaching pressure, but also serves as a displacementregulating mechanism and a buffer mechanism.

Specifically, the surface-approaching pressure imparting mechanism 4 asa displacement regulating mechanism can maintain initial pressingpressure by regulating air pressure against the change in the axialdirection caused by elongation or abrasion at the start of or in theoperation. As described above, the surface-approaching pressureimparting mechanism 4 uses a floating mechanism of maintaining thesecond processing member 20 so as to be displaced, thereby alsofunctioning as a buffer mechanism for micro-vibration or rotationalignment.

Now, the state of the thus constituted processing apparatus during useis described with reference to FIG. 1(A).

At the outset, a first fluid to be processed is pressurized with thefluid pressure imparting mechanism p1 and introduced through the firstintroduction part d1 into the internal space of the sealed case. On theother hand, the first processing member 10 is rotated with the rotationof the rotary shaft 50 by the rotation drive member. The firstprocessing surface 1 and the second processing surface 2 are therebyrotated relatively with a minute space kept therebetween.

The first processed fluid is formed into a thin film fluid between theprocessing surfaces 1 and 2 with a minute space kept therebetween, and asecond fluid to be processed which is introduced through the secondintroduction part d2 flows into the thin film fluid between theprocessing surfaces 1 and 2 to comprise a part of the thin film fluid.By this, the first and second processed fluids are mixed with eachother, and a uniform reaction of both of the fluids being reacted witheach other is promoted to form a reaction product. When the reaction isaccompanied by separation, relatively uniform and fine particles can beformed. Even when the reaction is not accompanied by separation, auniform reaction can be realized. The separated reaction product may befurther finely pulverized by shearing between the first processingsurface 1 and the second processing surface 2 with the rotation of thefirst processing surface 1. The first processing surface 1 and thesecond processing surface 2 are regulated to form a minute space of 1 μmto 1 mm, particularly 1 μM to 10 μm, thereby realizing a uniformreaction and enabling production of superfine particles of several nm indiameter.

The product is discharged from the processing surfaces 1 and 2 throughan outlet 32 of the case 3 to the outside of the case. The dischargedproduct is atomized in a vacuum or depressurized atmosphere with awell-known decompression device and converted into liquid in theatmosphere to collide with each other, then what trickled down in theliquid is able to be collected as degassed liquid.

In this embodiment, the processing apparatus is provided with a case 3,but may be carried out without a case. For example, a decompression tankfor degassing, that is, a vacuum tank, is arranged, and the processingapparatus may be arranged in this tank. In this case, the outletmentioned above is naturally not arranged in the processing apparatus.

As described above, the first processing surface 1 and the secondprocessing surface 2 can be regulated to form a minute space in theorder of μm which cannot be formed by arranging mechanical clearance.Now, this mechanism is described.

The first processing surface 1 and the second processing surface 2 arecapable of approaching to and separating from each other, andsimultaneously rotate relative to each other. In this example, the firstprocessing surface 1 rotates, and the second processing surface 2 slidesin the axial direction thereby approaching to and separating from thefirst processing surface.

In this example, therefore, the position of the second processingsurface 2 in the axial direction is arranged accurately in the order ofμm by the balance between forces, that is, the balance between thesurface-approaching pressure and the separating pressure, therebyestablishing a minute space between the processing surfaces 1 and 2.

As shown in FIG. 12(A), the surface-approaching pressure includes thepressure by air pressure (positive pressure) from the air introductionpart 44 by the surface-approaching pressure imparting mechanism 4, thepressing pressure with the spring 43, and the like.

The embodiments shown in FIG. 12 to FIG. 15 and FIG. 17 are shown byomitting the second introduction part d2 to simplify the drawings. Inthis respect, these drawings may be assumed to show sections at aposition not provided with the second introduction part d2. In thefigures, U and S show upward and downward directions respectively.

On the other hand, the separating force include the fluid pressureacting on the pressure-receiving surface at the separating side, thatis, on the second processing surface 2 and the separation regulatingsurface 23, the centrifugal force resulting from rotation of the firstprocessing member 10, and the negative pressure when negative pressureis applied to the air introduction part 44.

When the apparatus is washed, the negative pressure applied to the airintroduction part 44 can be increased to significantly separate theprocessing surfaces 1 and 2 from each other, thereby facilitatingwashing.

By the balance among these forces, the second processing surface 2 whilebeing remote by a predetermined minute space from the first processingsurface 1 is stabilized, thereby realizing establishment with accuracyin the order of μm.

The separating force is described in more detail.

With respect to fluid pressure, the second processing member 20 in aclosed flow path receives feeding pressure of a processed fluid, thatis, fluid pressure, from the fluid pressure imparting mechanism p1. Inthis case, the surfaces opposite to the first processing surface in theflow path, that is, the second processing surface 2 and the separationregulating surface 23, act as pressure-receiving surfaces at theseparating side, and the fluid pressure is applied to thepressure-receiving surfaces to generate a separating force due to thefluid pressure.

With respect to centrifugal force, the first processing member 10 isrotated at high speed, centrifugal force is applied to the fluid, and apart of this centrifugal force acts as separating force in the directionin which the processing surfaces 1 and 2 are separated from each other.

When negative pressure is applied from the air introduction part 44 tothe second processing member 20, the negative pressure acts asseparating force.

In the foregoing description of the present invention, the force ofseparating the first and second processing surfaces 1 and 2 from eachother has been described as a separating force, and the above-mentionedforce is not excluded from the separating force.

By forming a balanced state of the separating force and thesurface-approaching pressure applied by the surface-approaching pressureimparting mechanism 4 via the fluid between the processing surfaces 1and 2 in the closed flow path of the fluid, a uniform reaction isrealized between the processing surfaces 1 and 2, and simultaneously athin film fluid suitable for crystallization and separation ofmicroscopic reaction products is formed as described above. In thismanner, this apparatus can maintain a minute space between theprocessing surfaces 1 and 2 by the forced thin film fluid, the minutespace of is not achievable with a conventional mechanical apparatus, andmicroparticles can be formed highly accurately as the reaction product.

In other words, the thickness of the thin film fluid between theprocessing surfaces 1 and 2 is regulated as desired by regulating theseparating force and surface-approaching pressure, thereby realizing anecessary uniform reaction to form and process microscopic products.Accordingly, when the thickness of the thin film fluid is to bedecreased, the surface-approaching pressure or separating force may beregulated such that the surface-approaching pressure is made relativelyhigher than the separating force. When the thickness of the thin filmfluid is to be increased, the separating force or surface-approachingpressure may be regulated such that the separating force is maderelatively higher than the surface-approaching pressure.

When the surface-approaching pressure is increased, air pressure, thatis, positive pressure is applied from the air introduction part 44 bythe surface-approaching pressure imparting mechanism 4, or the spring 43is changed to the one having higher pressing pressure, or the number ofsprings may be increased.

When the separating force is to be increased, the feeding pressure ofthe fluid pressure imparting mechanism p1 is increased, or the area ofthe second processing surface 2 or the separation regulating surface 23is increased, or in addition, the rotation of the first processingmember 10 is regulated to increase centrifugal force or reduce pressurefrom the air introduction part 44. Alternatively, negative pressure maybe applied. The spring 43 shown is a pressing spring that generatespressing pressure in an extending direction, but may be a pulling springthat generates a force in a compressing direction to constitute a partor the whole of the surface-approaching pressure imparting mechanism 4.

When the separating force is to be decreased, the feeding pressure ofthe fluid pressure imparting mechanism p1 is reduced, or the area of thesecond processing surface 2 or the separation regulating surface 23 isreduced, or in addition, the rotation of the first processing member 10is regulated to decrease centrifugal force or increase pressure from theair introduction part 44. Alternatively, negative pressure may bereduced.

Further, properties of a processed fluid, such as viscosity, can beadded as a factor for increasing or decreasing the surface-approachingpressure and separating force, and regulation of such properties of aprocessed fluid can be performed as regulation of the above factor.

In the separating force, the fluid pressure exerted on thepressure-receiving surface at the separating side, that is, the secondprocessing surface 2 and the separation regulating surface 23 isunderstood as a force constituting an opening force in mechanical seal.

In the mechanical seal, the second processing member 20 corresponds to acompression ring, and when fluid pressure is applied to the secondprocessing member 20, the force of separating the second processingmember 20 from the first processing member 10 is regarded as openingforce.

More specifically, when the pressure-receiving surfaces at a separatingside, that is, the second processing surface 2 and the separationregulating surface 23 only are arranged in the second processing member20 as shown in the first embodiment, all feeding pressure constitutesthe opening force. When a pressure-receiving surface is also arranged atthe backside of the second processing member 20, specifically in thecase of FIG. 12(B) and FIG. 17 described later, the difference betweenthe feeding pressure acting as a separating force and the feedingpressure acting as surface-approaching pressure is the opening force.

Now, other embodiments of the second processing member 20 are describedwith reference to FIG. 12(B).

As shown in FIG. 12(B), an approach regulating surface 24 facing upward,that is, at the other side of the second processing surface 2, isdisposed at the inner periphery of the second processing member 20exposed from the ring-accepting part 41.

That is, the surface-approaching pressure imparting mechanism 4 in thisembodiment is comprised of a ring-accepting part 41, an air introductionpart 44, and the approach regulating surface 24. However, thesurface-approaching pressure imparting mechanism 4 may be one includingat least one member selected from the ring-accepting part 41, thespring-accepting part 42, the spring 43, the air introduction part 44,and the approach regulating surface 24.

The approach regulating surface 24 receives predetermined pressureapplied to a processed fluid to generate a force of approaching thesecond processing surface 2 to the first processing surface 1, therebyfunctioning in feeding surface-approaching pressure as a part of thesurface-approaching pressure imparting mechanism 4. On the other hand,the second processing surface 2 and the separation regulating surface 23receive predetermined pressure applied to a processed fluid to generatea force of separating the second processing surface 2 from the firstprocessing surface 1, thereby functioning in feeding a part of theseparating force.

The approach regulating surface 24, the second processing surface 2 andthe separation regulating surface 23 are pressure-receiving surfacesreceiving feeding pressure of the processed fluid, and depending on itsdirection, exhibits different actions, that is, generation of thesurface-approaching pressure and generation of a separating force.

The ratio (area ratio A1/A2) of a projected area A1 of the approachregulating surface 24 projected on a virtual plane perpendicular to thedirection of approaching and separating the processing surfaces, thatis, in the direction of rising and setting of the second ring 20, to atotal area A2 of the projected area of the second processing surface 2and the separating side pressure-receiving area 23 of the secondprocessing member 20 projected on the virtual plane is called balanceratio K which is important for regulation of the opening force.

Both the top of the approach regulating surface 24 and the top of theseparating side pressure-receiving surface 23 are defined by the innerperiphery 25 of the circular second regulating part 20, that is, by topline L1. Accordingly, the balance ratio is regulated for deciding theplace where base line L2 of the approach regulating surface 24 is to beplaced.

That is, in this embodiment, when the feeding pressure of the processedfluid is utilized as opening force, the total projected area of thesecond processing surface 2 and the separation regulating surface 23 ismade larger than the projected area of the approach regulating surface24, thereby generating an opening force in accordance with the arearatio.

The opening force can be regulated by the pressure of the processedfluid, that is, the fluid pressure, by changing the balance line, thatis, by changing the area A1 of the approach regulating surface 24.

Sliding surface actual surface pressure P, that is, the fluid pressureout of the surface-approaching pressure, is calculated according to thefollowing equation:P=P1×(K−k)+Pswherein P1 represents the pressure of a processed fluid, that is, fluidpressure; K represents the balance ratio; k represents an opening forcecoefficient; and Ps represents a spring and back pressure.

By regulating this balance line to regulate the sliding surface actualsurface pressure P, the space between the processing surfaces 1 and 2 isformed as a desired minute space, thereby forming a film of the fluid tomake the product minute and effecting uniform reaction processing.

Usually, as the thickness of a thin film fluid between the processingsurfaces 1 and 2 is decreased, the product can be made finer. On theother hand, as the thickness of the thin film fluid is increased,processing becomes rough and the throughput per unit time is increased.By regulating the sliding surface actual surface pressure P on thesliding surface, the space between the processing surfaces 1 and 2 canbe regulated to realize the desired uniform reaction and to obtain theminute product. Hereinafter, the sliding surface actual surface pressureP is referred to as surface pressure P.

From this relation, it is concluded that when the product is to be madecoarse, the balance ratio may be decreased, the surface pressure P maybe decreased, the space may be increased and the thickness of the filmmay be increased. On the other hand, when the product is to be madefiner, the balance ratio may be increased, the surface pressure P may beincreased, the space may be decreased and the thickness of the film maybe decreased.

As a part of the surface-approaching pressure imparting mechanism 4, theapproach regulating surface 24 is formed, and at the position of thebalance line, the surface-approaching pressure may be regulated, thatis, the space between the processing surfaces may be regulated.

As described above, the space is regulated in consideration of thepressing pressure of the spring 43 and the air pressure of the airintroduction part 44. Regulation of the fluid pressure, that is, thefeeding pressure of the processed fluid, and regulation of the rotationof the first processing member 10 for regulating centrifugal force, thatis, the rotation of the first holder 11, are also important factors toregulate the space.

As described above, this apparatus is constituted such that for thesecond processing member 20 and the first processing member 10 thatrotates relative to the second processing member 20, a predeterminedthin film fluid is formed between the processing surfaces by pressurebalance among the feeding pressure of the processed fluid, the rotationcentrifugal force, and the surface-approaching pressure. At least one ofthe rings is formed in a floating structure by which alignment such asrun-out is absorbed to eliminate the risk of abrasion and the like.

The embodiment shown in FIG. 1(A) also applies to the embodiment in FIG.12(B) except that the regulating surface is arranged.

The embodiment shown in FIG. 12(B) can be carried out without arrangingthe pressure-receiving surface 23 on the separating side, as shown inFIG. 17.

When the approach regulating surface 24 is arranged as shown in theembodiment shown in FIG. 12(B) and FIG. 17, the area A1 of the approachregulating surface 24 is made larger than the area A2, whereby all ofthe predetermined pressure exerted on the processed fluid functions assurface-approaching pressure, without generating an opening force. Thisarrangement is also possible, and in this case, both the processingsurfaces 1 and 2 can be balanced by increasing other separating force.

With the area ratio described above, the force acting in the directionof separating the second processing surface 2 from the first processingsurface 1 is fixed as the resultant force exerted by the fluid.

In this embodiment, as described above, the number of springs 43 ispreferably larger in order to impart uniform stress on the slidingsurface, that is, the processing surface. However, the spring 43 may bea single coil-type spring as shown in FIG. 13. As shown in the figure,this spring is a single coil spring having a center concentric with thecircular second processing member 20.

The space between the second processing member 20 and the second holder21 is sealed air-tightly with methods well known in the art.

As shown in FIG. 14, the second holder 21 is provided with a temperatureregulation jacket 46 capable of regulating the temperature of the secondprocessing member 20 by cooling or heating. Numerical 3 in FIG. 14 isthe above-mentioned case, and the case 3 is also provided with a jacket35 for the same purpose of temperature regulation.

The temperature regulation jacket 46 for the second holder 21 is awater-circulating space formed at a side of the ring-accepting part 41and communicates with paths 47 and 48 leading to the outside of thesecond holder 21. One of the paths 47 and 48 introduces a cooling orheating medium into the temperature regulation jacket 46, and the otherdischarges the medium.

The temperature regulation jacket 35 for the case 3 is a path forpassing heating water or cooling water, which is arranged between theouter periphery of the case 3 and a covering part 34 for covering theouter periphery of the case 3.

In this embodiment, the second holder 21 and the case 3 are providedwith the temperature regulation jacket, but the first holder 11 can alsobe provided with such a jacket.

As a part of the surface-approaching pressure imparting mechanism 4, acylinder mechanism 7 shown in FIG. 15 may be arranged besides themembers described above.

The cylinder mechanism 7 includes a cylinder space 70 arranged in thesecond holder 21, a communicating part 71 that communicates the cylinderspace 70 with the ring-accepting part 41, a piston 72 that is acceptedin the cylinder space 70 and connected via the communication part 71 tothe second processing member 20, a first nozzle 73 that communicates tothe upper part of the cylinder space 70, a second nozzle 74 thatcommunicates to a lower part of the cylinder space 70, and a pressingbody 75 such as spring between the upper part of the cylinder space 70and the piston 72.

The piston 72 can slide vertically in the cylinder space 70, and thesecond processing member 20 can slide vertically with sliding of thepiston 72, to change the gap between the first processing surface 1 andthe second processing surface 2.

Although not shown in the figure, specifically, a pressure source suchas a compressor is connected to the first nozzle 73, and air pressure,that is, positive pressure is applied from the first nozzle 73 to theupper part of the piston 72 in the cylinder space 70, thereby slidingthe piston 72 downward, to narrow the gap between the first and secondprocessing surfaces 1 and 2. Although not shown in the figure, apressure source such as a compressor is connected to the second nozzle74, and air pressure, that is, positive pressure is applied from thesecond nozzle 74 to the lower part of the piston 72 in the cylinderspace 70, thereby sliding the piston 72 upward, to allow the secondprocessing member 20 to widen the gap between the first and secondprocessing surfaces 1 and 2, that is, to enable it to move in thedirection of opening the gap. In this manner, the surface-approachingpressure can be regulated by air pressure with the nozzles 73 and 74.

Even if there is a space between the upper part of the second processingmember 20 in the ring-accepting part 41 and the uppermost part of thering-accepting part 41, the piston 72 is arranged so as to abut againstthe uppermost part 70 a of the cylinder space 70, whereby the uppermostpart 70 a of the cylinder space 70 defines the upper limit of the widthof the gap between the processing surfaces 1 and 2. That is, the pistonand the uppermost part 70 a of the cylinder space 70 function as aseparation preventing part for preventing the separation of theprocessing surfaces 1 and 2 from each other, in other words, function inregulating the maximum opening of the gap between both the processingsurfaces 1 and 2.

Even if the processing surfaces 1 and 2 do not abut on each other, thepiston 72 is arranged so as to abut against a lowermost part 70 b of thecylinder space 70, whereby the lowermost part 70 b of the cylinder space70 defines the lower limit of the width of the gap between theprocessing surfaces 1 and 2. That is, the piston 72 and the lowermostpart 70 b of the cylinder space 70 function as an approach preventingpart for preventing the approaching of the processing surfaces 1 and 2each other, in other words, function in regulating the minimum openingof the gap between both the processing surfaces 1 and 2.

In this manner, the maximum and minimum openings of the gap areregulated, while a distance z1 between the piston 72 and the uppermostpart 70 a of the cylinder space 70, in other words, a distance z2between the piston 72 and the lowermost part 70 b of the cylinder space70, is regulated with air pressure by the nozzles 73 and 74.

The nozzles 73 and 74 may be connected to a different pressure sourcerespectively, and further may be connected to a single pressure sourcealternatively or switched the connections to the sources.

The pressure source may be a source applying positive or negativepressure. When a negative pressure source such as a vacuum is connectedto the nozzles 73 and 74, the action described above goes to thecontrary.

In place of the other surface-approaching pressure imparting mechanism 4or as a part of the surface-approaching pressure imparting mechanism 4,such cylinder mechanism 7 is provided to set the pressure of thepressure source connected to the nozzle 73 and 74, and the distances z1and z2 according to the viscosity and properties of the fluid to beprocessed in a fashion to bring the thickness value of thin film fluidof the fluid to a desired level under a shear force to realize a uniformreaction for forming fine particles. Particularly, such cylindermechanism 7 can be used to increase the reliability of cleaning andsterilization by forcing the sliding part open and close during cleaningand steam sterilization.

As shown in FIG. 16(A) to FIG. 16(C), the first processing surface 1 ofthe first processing member 10 may be provided with groove-likedepressions 13 . . . 13 extending in the radial direction, that is, inthe direction from the center to the outside of the first processingmember 10. In this case, as shown in FIG. 16(A), the depressions 13 . .. 13 can be curved or spirally elongated on the first processing surface1, and as shown in FIG. 16(B), the individual depressions 13 may be bentat a right angle, or as shown in FIG. 16(C), the depressions 13 . . . 13may extend straight radially.

As shown in FIG. 16(D), the depressions 13 in FIG. 16(A) to FIG. 16(C)preferably deepen gradually in the direction toward the center of thefirst processing surface 1. The groove-like depressions 13 may continuein sequence or intermittence.

Formation of such depression 13 may correspond to the increase ofdelivery of the processed fluid or to the decrease of calorific value,while having effects of cavitation control and fluid bearing.

In the embodiments shown in FIG. 16, the depressions 13 are formed onthe first processing surface 1, but may be formed on the secondprocessing surface 2 or may be formed on both the first and secondprocessing surfaces 1 and 2.

When the depressions 13 or tapered sections are not provided on theprocessing surface or are arranged unevenly on a part of the processingsurface, the influence exerted by the surface roughness of theprocessing surfaces 1 and 2 on the processed fluid is greater than thatby the above depressions 13. In this case, the surface roughness shouldbe reduced, that is, the surface should be fine-textured, as theparticle size of the processed fluid are to be decreased. Particularly,regarding the surface roughness of the processing surface, the mirrorsurface, that is, a surface subjected to mirror polishing isadvantageous in realizing uniform reaction for the purpose of uniformreaction, and in realizing crystallization and separation of finemonodisperse reaction products for the purpose of obtainingmicroparticles.

In the embodiments shown in FIG. 13 to FIG. 17, structures other thanthose particularly shown are the same as in the embodiments shown inFIG. 1(A) or FIG. 11(C).

In the embodiments described above, the case is closed. Alternatively,the first processing member 10 and the second processing member 20 maybe closed inside but may be open outside. That is, the flow path issealed until the processed fluid has passed through the space betweenthe first processing surface 1 and the second processing surface 2, toallow the processed fluid to receive the feeding pressure, but after thepassing, the flow path may be opened so that the processed fluid afterprocessing does not receive feeding pressure.

The fluid pressure imparting mechanism p1 preferably uses a compressoras a pressure device described above, but if predetermined pressure canalways be applied to the processed fluid, another means may be used. Forexample, the own weight of the processed fluid can be used to applycertain pressure constantly to the processed fluid.

In summary, the processing apparatus in each embodiment described aboveis characterized in that predetermined pressure is applied to a fluid tobe processed, at least two processing surfaces, that is, a firstprocessing surface 1 and a second processing surface 2 capable ofapproaching to and separating from each other are connected to a sealedflow path through which the processed fluid receiving the predeterminedpressure flows, a surface-approaching pressure of approaching theprocessing surfaces 1 and 2 each other is applied to rotate the firstprocessing surface 1 and the second processing surface 2 relative toeach other, thereby allowing a thin film fluid used for seal inmechanical seal to be generated out of the processed fluid, and the thinfilm fluid is leaked out consciously (without using the thin film fluidas seal) from between the first processing surface 1 and the secondprocessing surface 2, contrary to mechanical seal, whereby reactionprocessing is realized between the processed fluid formed into a filmbetween the surfaces 1 and 2, and the product is recovered.

By this epoch-making method, the space between the processing surfaces 1and 2 can be regulated in the range of 1 μm to 1 mm, particularly 1 μmto 10 μm.

In the embodiment described above, a flow path for a sealed fluid isconstituted in the apparatus, and the processed fluid is pressurizedwith the fluid pressure imparting mechanism p1 arranged at the side ofthe introduction part (for the first processing fluid) in the processingapparatus.

Alternatively, the flow path for the processed fluid may be openedwithout pressurization with the fluid pressure imparting mechanism p1.

One embodiment of the processing apparatus is shown in FIG. 18 to FIG.20. The processing apparatus illustrated in this embodiment is anapparatus including a degassing mechanism, that is, a mechanism ofremoving a liquid from the processed product thereby finally securingobjective solids (crystals) only.

FIG. 18(A) is a schematic vertical sectional view of the processingapparatus, and FIG. 18(B) is its partially cut enlarged sectional view.FIG. 19 is a plane view of the first processing member 101 arranged inthe processing apparatus in FIG. 18. FIG. 20 is a partially cutschematic vertical sectional view showing an important part of the firstand second processing members 101 and 102 in the processing apparatus.

As described above, the apparatus shown in FIG. 18 to FIG. 20 is the oneinto which a fluid as the object of processing, that is, a processedfluid, or a fluid carrying the object of processing, is to be introducedat atmospheric pressure.

In FIG. 18(B) and FIG. 20, the second introduction part d2 is omittedfor simplicity of the drawing (these drawings can be regarded as showinga section at the position where the second introduction part d2 is notarranged).

As shown in FIG. 18(A), this processing apparatus includes a reactionapparatus G and a decompression pump Q. This reaction apparatus Gincludes a first processing member 101 as a rotating member, a firstholder 111 for holding the processing member 101, a second processingmember 102 that is a member fixed to the case, a second holder 121having the second processing member 102 fixed thereto, a bias mechanism103, a dynamical pressure generating mechanism 104 (FIG. 19(A)), a drivepart which rotates the first processing member 101 with the first holder111, a housing 106, a first introduction part d1 which supplies(introduces) a first processed fluid, and a discharge part 108 thatdischarges the fluid to the decompression pump Q. The drive part is notshown.

The first processing member 101 and the second processing member 102 arecylindrical bodies that are hollow in the center. The processing members101 and 102 are members wherein the bottoms of the processing members101 and 102 in a cylindrical form are processing surfaces 110 and 120respectively.

The processing surfaces 110 and 120 have a mirror-polished flat part. Inthis embodiment, the processing surface 120 of the second processingmember 102 is a flat surface subjected as a whole to mirror polishing.The processing surface 110 of the first processing member 101 is a flatsurface as a whole like the second processing member 102, but has aplurality of grooves 112 . . . 112 in the flat surface as shown in FIG.19(A). The grooves 112 . . . 112 while centering on the first processingmember 101 in a cylindrical form extend radially toward the outerperiphery of the cylinder.

The processing surfaces 110 and 120 of the first and second processingmembers 101 and 102 are mirror-polished such that the surface roughnessRa comes to be in the range of 0.01 μm to 1.0 μm. By this mirrorpolishing, Ra is regulated preferably in the range of 0.03 μm to 0.3 μm.

The material for the processing members 101 and 102 is one which isrigid and capable of mirror polishing. The rigidity of the processingmembers 101 and 102 is preferably at least 1500 or more in terms ofVickers hardness. A material having a low linear expansion coefficientor high thermal conductance is preferably used. This is because when thedifference in coefficient of expansion between a part which generatesheat upon processing and other parts is high, distortion is generatedand securement of suitable clearance is influenced.

As the material for the processing members 101 and 102, it is preferableto use particularly SIC, that is, silicon carbide, SIC having a Vickershardness of 2000 to 2500, SIC having a Vickers hardness of 3000 to 4000coated thereon with DLC (diamond-like carbon), WC, that is, tungstencarbide having a Vickers hardness of 1800, WC coated thereon with DLC,and boron ceramics represented by ZrB₂, BTC and B₄C having a Vickershardness of 4000 to 5000.

The housing 106 shown in FIG. 18, the bottom of which is not shownthough, is a cylinder with a bottom, and the upper part thereof iscovered with the second holder 121. The second holder 121 has the secondprocessing member 102 fixed to the lower surface thereof, and theintroduction part d1 is arranged in the upper part thereof. Theintroduction part d1 is provided with a hopper 170 for introducing afluid or a processed material from the outside.

Although not shown in the figure, the drive part includes a power sourcesuch as a motor and a shaft 50 that rotates by receiving power from thepower source.

As shown in FIG. 18(A), the shaft 50 is arranged in the housing 106 andextends vertically. Then, the first holder 111 is arranged on the top ofthe shaft 50. The first holder 111 is to hold the first processingmember 101 and is arranged on the shaft 50 as described above, therebyallowing the processing surface 110 of the first processing member 101to correspond to the processing surface 120 of the second processingmember 102.

The first holder 111 is a cylindrical body, and the first processingmember 101 is fixed on the center of the upper surface. The firstprocessing member 101 is fixed so as to be integrated with the firstholder 111, and does not change its position relative to the firstholder 111.

On the other hand, a receiving depression 124 for receiving the secondprocessing member 102 is formed on the center of the upper surface ofthe second holder 121.

The receiving depression 124 has a circular cross-section. The secondprocessing member 102 is accepted in the cylindrical receivingdepression 124 so as to be concentric with the receiving depression 124.

The structure of the receiving depression 124 is similar to that in theembodiment as shown in FIG. 1(A) (the first processing member 101corresponds to the first ring 10, the first holder 111 to the firstholder 11, the second processing member 102 to the second ring 20, andthe second holder 121 to the second holder 21).

Then, the second holder 121 is provided with the bias mechanism 103. Thebias mechanism 103 preferably uses an elastic body such as spring. Thebias mechanism 103 corresponds to the surface-approaching pressureimparting mechanism 4 in FIG. 1(A) and has the same structure. That is,the bias mechanism 103 presses that side (bottom) of the secondprocessing member 102 which is opposite to the processing surface 120and biases each position of the second processing member 102 uniformlydownward to the first processing member 101.

On the other hand, the inner diameter of the receiving depression 124 ismade larger than the outer diameter of the second processing member 102,so that when arranged concentrically as described above, a gap t1 isarranged between outer periphery 102 b of the second processing member102 and inner periphery of the receiving depression 124, as shown inFIG. 18(B).

Similarly, a gap t2 is arranged between inner periphery 102 a of thesecond processing member 102 and outer periphery of the central part 22of the receiving depression 124, as shown in FIG. 18(B).

The gaps t1 and t2 are those for absorbing vibration and eccentricbehavior and are set to be in a size to secure operational dimensions ormore and to enable sealing. For example, when the diameter of the firstprocessing member 101 is 100 mm to 400 mm, the gaps t1 and t2 arepreferably 0.05 mm to 0.3 mm, respectively.

The first holder 111 is fixed integrally with the shaft 50 and rotatedwith the shaft 50. The second processing member 102 is not rotatedrelative to the second holder 121 by a baffle (not shown). However, forsecuring 0.1 micron to 10 micron clearance necessary for processing,that is, the minute gap t between the processing surfaces 110 and 120 asshown in FIG. 20(B), a gap t3 is arranged between the bottom of thereceiving depression 124, that is, the top part, and the surface facinga top part 124 a of the second processing member 102, that is, the upperpart. The gap t3 is established in consideration of the clearance andthe vibration and elongation of the shaft 150.

As described above, by the provision of the gaps t1 to t3, the secondprocessing member 102 can move not only in the direction z1 ofapproaching to and separating from the first processing member 101, butalso relative to the center and inclination, that is, the direction z2of the processing surface 120.

That is, in this embodiment, the bias mechanism 103 and the gaps t1 tot3 constitute a floating mechanism, and by this floating mechanism, thecenter and inclination of at least the second processing member 102 aremade variable in the small range of several μm to several mm. Therun-out and expansion of the rotary shaft and the surface vibration andvibration of the first processing member 101 are absorbed.

The groove 112 on the processing surface 110 of the first processingmember 101 is described in more detail. The rear end of the groove 112reaches the inner periphery 101 a of the first processing member 101,and its top is elongated toward the outside y of the first processingmember 101, that is, toward the outer periphery. As shown in FIG. 19(A),the sectional area of the groove 112 is gradually decreased in thedirection from the center x of the circular first processing member 101to the outside y of the first processing member 101, that is, toward theouter periphery.

The distance w1 of the left and right sides 112 a and 112 b of thegroove 112 is decreased in the direction from the center x of the firstprocessing member 101 to the outside y of the first processing member101, that is, toward the outer periphery. As shown in FIG. 19(B), thedepth w2 of the groove 112 is decreased in the direction from the centerx of the first processing member 101 to the outside y of the firstprocessing member 101, that is, toward the outer periphery. That is, thebottom 112 c of the groove 112 is decreased in depth in the directionfrom the center x of the first processing member 101 to the outside y ofthe first processing member 101, that is, toward the outer periphery.

As described above, the groove 112 is gradually decreased both in widthand depth toward the outside y, that is, toward the outer periphery, andits sectional area is gradually decreased toward the outside y. Then,the top of the groove 112, that is, the y side, is a dead end. That is,the top of the groove 112, that is, the y side does not reach the outerperiphery 101 b of the first processing member 101, and an outer flatsurface 113 is interposed between the top of the groove 112 and theouter periphery 101 b. The outer flat surface 113 is a part of theprocessing surface 110.

In the embodiment shown in FIG. 19, the left and right sides 112 a and112 b and the bottom 112 c of the groove 112 constitute a flow pathlimiting part. This flow path limiting part, the flat part around thegroove 112 of the first processing member 101, and the flat part of thesecond processing member 102 constitute the dynamical pressuregenerating mechanism 104.

However, only one of the width and depth of the groove 112 may beconstituted as described above to decrease the sectional area.

While the first processing member 101 rotates, the dynamical pressuregenerating mechanism 104 generates a force in the direction ofseparating the processing members 101 and 102 from each other to securea desired minute space between the processing members 101 and 102 by afluid passing through the space between the processing members 101 and102. By generation of such dynamical pressure, a 0.1 μm to 10 μm minutespace can be generated between the processing surfaces 110 and 120. Aminute space like that can be regulated and selected depending on theobject of processing, but is preferably 1 μm to 6 μm, more preferably 1μm to 2 μm. This apparatus can realize a uniform reaction and formmicroparticles by the minute space, which are not achieved in the priorart.

The grooves 112 . . . 112 may extend straight from the center x to theoutside y. In this embodiment, however, as shown in FIG. 19(A), thegrooves 112 are curved to extend such that with respect to a rotationdirection r of the first processing member 101, the center x of thegroove 112 is positioned in front of the outside y of the groove 112.

In this manner, the grooves 112 . . . 112 are curved to extend so thatthe separation force by the dynamical pressure generating mechanism 104can be effectively generated.

Then, the working of this apparatus is described.

A first processed fluid R which has been introduced from a hopper 170and has passed through the first introduction part d1, passes throughthe hollow part of the circular second processing member 102, and thefirst processed fluid R that has received the centrifugal forceresulting from rotation of the first processing member 101 enters thespace between the processing members 101 and 102, and uniform reactionand generation of microparticles are effected and processed between theprocessing surface 110 of the rotating first processing member 101 andthe processing surface 120 of the second processing member 102, thenexits from the processing members 101 and 102 and is then dischargedfrom the discharge part 108 to the side of the decompression pump Q.Hereinafter, the first processed fluid R is referred to simply as afluid R, if necessary.

In the foregoing description, the fluid R that has entered the hollowpart of the circular second processing member 102 first enters thegroove 112 of the rotating first processing member 101 as shown in FIG.20(A). On the other hand, the processing surfaces 110 and 120 that aremirror-polished flat parts are kept airtight even by passing a gas suchas air or nitrogen. Accordingly, even if the centrifugal force byrotation is received, the fluid cannot enter through the groove 112 intothe space between the processing surfaces 110 and 120 that are pushedagainst each other by the bias mechanism 103. However, the fluid Rgradually runs against both the sides 112 a and 112 b and the bottom 112c of the groove 112 formed as a flow path limiting part to generatedynamical pressure acting in the direction of separating the processingsurfaces 110 and 120 from each other. As shown in FIG. 20(B), the fluidR can thereby exude from the groove 112 to the flat surface, to secure aminute gap t, that is, clearance, between the processing surfaces 110and 120. Then, a uniform reaction and generation of microparticles areeffected and processed between the mirror-polished flat surfaces. Thegroove 112 has been curved so that the centrifugal force is applied moreaccurately to the fluid to make generation of dynamical pressure moreeffectively.

In this manner, the processing apparatus can secure a minute and uniformgap, that is, clearance, between the mirror surfaces, that is, theprocessing surfaces 110 and 120, by the balance between the dynamicalpressure and the bias force by the bias mechanism 103. By the structuredescribed above, the minute gap can be as superfine as 1 μm or less.

By utilizing the floating mechanism, the automatic regulation ofalignment between the processing surfaces 110 and 120 becomes possible,and the clearance in each position between the processing surfaces 110and 120 can be prevented from varying against physical deformation ofeach part by rotation or generated heat, and the minute gap in eachposition can be maintained.

In the embodiment described above, the floating mechanism is a mechanismarranged for the second holder 121 only. Alternatively, the floatingmechanism can be arranged in the first holder 111 instead of, ortogether with, the second holder 121.

Other embodiments of the groove 112 are shown in FIG. 21 to FIG. 23.

As shown in FIG. 21(A) and FIG. 21(B), the groove 112 can be provided atthe top with a flat wall surface 112 d as a part of the flow pathlimiting part. In this embodiment, a step 112 e is arranged between thefirst wall surface 112 d and the inner periphery 101 a in the bottom 112c, and the step 112 e also constitutes a part of the flow path limitingpart.

As shown in FIG. 22(A) and FIG. 22(B), the groove 112 includes aplurality of branches 112 f . . . 112 f, and each branch 112 f narrowsits width there by being provided with a flow path limiting part.

With respect to the embodiments as well, structures other than thoseparticularly shown are similar to those of embodiments as shown in FIG.1(A), FIG. 11(C), and FIG. 18 to FIG. 20.

In the embodiments described above, at least either the width or depthof the groove 112 is gradually decreased in size in the direction frominside to outside the first processing member 101, thereby constitutinga flow path limiting part. Alternatively, as shown in FIG. 23(A) or FIG.23(B), the groove 112 can be provided with a termination surface 112 fwithout changing the width and depth of the groove 112, and thetermination surface 112 f of the groove 112 can serve as a flow pathlimiting part. As shown the embodiments in FIG. 19, FIG. 21 and FIG. 22,the width and depth of the groove 112 can be changed as described abovethereby slanting the bottom and both sides of the groove 112, so thatthe slanted surfaces serves as a pressure-receiving part toward thefluid to generate dynamical pressure. In the embodiment shown in FIG.23(A) and FIG. 23(B), on the other hand, the termination surface of thegroove 112 serves as a pressure-receiving part toward the fluid togenerate dynamical pressure.

In the embodiment shown in FIG. 23(A) and FIG. 23(B), at least one ofthe width and depth of the groove 112 may also be gradually decreased insize.

The structure of the groove 112 is not limited to the one shown in FIG.19 and FIG. 21 to FIG. 23 and can be provided with a flow path limitingpart having other shapes.

For example, in the embodiments shown in FIG. 19 and FIG. 21 to FIG. 23,the groove 112 does not penetrate to the outer side of the firstprocessing member 101. That is, there is an outer flat surface 113between the outer periphery of the first processing member 101 and thegroove 112. However, the structure of the groove 112 is not limited tosuch embodiment, and the groove 112 may reach the outer periphery of thefirst processing member 101 as long as the dynamical pressure can begenerated.

For example, in the case of the first processing member 101 shown inFIG. 23(B), as shown in the dotted line, a part having a smallersectional area than other sites of the groove 112 can be formed on theouter flat surface 113.

The groove 112 may be formed so as to be gradually decreased in size inthe direction from inside to outside as described above, and the part(terminal) of the groove 112 that had reached the outer periphery of thefirst processing member 101 may have the minimum sectional area (notshown). However, the groove 112 preferably does not penetrate to theouter periphery of the first processing member 101 as shown in FIG. 19and FIG. 21 to FIG. 23, in order to effectively generate dynamicalpressure.

Now, the embodiments shown in FIG. 18 to FIG. 23 are summarized.

This processing apparatus is a processing apparatus wherein a rotatingmember having a flat processing surface and a fixed member having a flatprocessing surface are opposite to each other so as to be concentricwith each other, and while the rotating member is rotated, a material tobe reacted is fed through an opening of the fixed member and subjectedto a reaction between the opposite flat processing surfaces of bothmembers, wherein the rotating member is provided with a pressurizingmechanism by which pressure is generated to maintain clearance withoutmechanically regulating clearance and enables 1 μm to 6 μm microscopicclearance not attainable by mechanical regulation of clearance, therebysignificantly improving an ability to pulverize formed particles and anability to uniformize the reaction.

That is, this processing apparatus have a rotating member and a fixedmember each having a flat processing surface in the outer peripherythereof and has a sealing mechanism in a plane on the flat processingsurface, thereby providing a high speed rotation processing apparatusgenerating hydrostatic force, hydrodynamic force, oraerostatic-aerodynamic force. The force generates a minute space betweenthe sealed surfaces, and provides a reaction processing apparatus with afunction of non-contact and mechanically safe and high-levelpulvelization and uniformizing of reactions. One factor for forming thisminute space is due to the rotation speed of the rotating member, andthe other factor is due to a pressure difference between theintroduction side and discharge side of a processed material (fluid).When a pressure imparting mechanism is arranged in the introductionside, when a pressure imparting mechanism is not arranged in theintroduction side, that is, when the processed material (fluid) isintroduced at atmospheric pressure, there is no pressure difference, andthus the sealed surfaces should be separated by only the rotation speedof the rotating member. This is known as hydrodynamic or aerodynamicforce.

FIG. 18(A) shows the apparatus wherein a decompression pump Q isconnected to the discharge part of the reaction apparatus G, but asdescribed above, the reaction apparatus G may be arranged in adecompression tank T without arranging the housing 106 and thedecomposition pump Q, as shown in FIG. 24(A).

In this case, the tank T is decompressed in a vacuum or in an almostvacuum, whereby the processed product formed in the reaction apparatus Gis sprayed in a mist form in the tank T, and the processed materialcolliding with, and running down along, the inner wall of the tank T canbe recovered, or a gas (vapor) separated from the processed material andfilled in an upper part of the tank T, unlike the processed materialrunning down along the wall, can be recovered to obtain the objectiveproduct after processing.

When the decompression pump Q is used, an airtight tank T is connectedvia the decompression pump Q to the processing apparatus G, whereby theprocessed material after processing can be formed into mist to separateand extract the objective product.

As shown in FIG. 24(C), the decompression pump Q is connected directlyto the Tank T, and the decompression pump Q and a discharge part forfluid R, different from the decompression pump Q, are connected to thetank T, whereby the objective product can be separated. In this case, agasified portion is sucked by the decompression pump Q, while the fluidR (liquid portion) is discharged from the discharge part separately fromthe gasified portion.

In the embodiments described above, the first and second processedfluids are introduced via the second holders 21 and 121 and the secondrings 20 and 102 respectively and mixed and reacted with each other.

Now, other embodiments with respect to introduction of fluids to beprocessed into the apparatus are described.

As shown in FIG. 1(B), the processing apparatus shown in FIG. 1(A) isprovided with a third introduction part d3 to introduce a third fluid tobe processed into the space between the processing surfaces 1 and 2, andthe third fluid is mixed and reacted with the first processed fluid aswell as the second processed fluid.

By the third introduction part d3, the third fluid to be mixed with thefirst processed fluid is fed to the space between the processingsurfaces 1 and 2. In this embodiment, the third introduction part d3 isa fluid flow path arranged in the second ring 20 and is open at one endto the second processing surface 2 and has a third fluid feed part p3connected to the other end.

In the third fluid feed part p3, a compressor or another pump can beused.

The opening of the third introduction part d3 in the second processingsurface 2 is positioned outside, and more far from, the rotation centerof the first processing surface 1 than the opening of the secondintroduction part d2. That is, in the second processing surface 2, theopening of the third introduction part d3 is located downstream from theopening of the second introduction part d2. A gap is arranged betweenthe opening of the third introduction d3 and the opening of the secondintroduction part d2 in the radial direction of the second ring 20.

With respect to structures other than the third introduction d3, theapparatus shown in FIG. 1(B) is similar to that in the embodiment as inFIG. 1(A). In FIG. 1(B) and further in FIG. 1(C), FIG. 1(D) and FIG. 2to FIG. 11 described later, the case 3 is omitted to simplify thedrawings. In FIG. 9(B), FIG. 9(C), FIG. 10, FIG. 11(A) and FIG. 11(B), apart of the case 3 is shown.

As shown in FIG. 1(C), the processing apparatus shown in FIG. 1(B) isprovided with a fourth introduction part d4 to introduce a fourth fluidto be processed into the space between the processing surfaces 1 and 2,and the fourth fluid is mixed and reacted with the first processed fluidas well as the second and third processed fluids.

By the fourth introduction part d4, the fourth fluid to be mixed withthe first processed fluid is fed to the space between the processingsurfaces 1 and 2. In this embodiment, the fourth introduction part d4 isa fluid flow path arranged in the second ring 20, is open at one end tothe second processing surface 2, and has a fourth fluid feed part p4connected to the other end.

In the fourth fluid feed part p4, a compressor or another pump can beused.

The opening of the fourth introduction part d4 in the second processingsurface 2 is positioned outside, and more far from, the rotation centerof the first processing surface 1 than the opening of the thirdintroduction part d3. That is, in the second processing surface 2, theopening of the fourth introduction part d4 is located downstream fromthe opening of the third introduction part d3.

With respect to structures other than the fourth introduction part d4,the apparatus shown in FIG. 1(C) is similar to that in the embodiment asin FIG. 1(B).

Five or more introduction parts further including a fifth introductionpart, a sixth introduction part and the like can be arranged to mix andreact five or more fluids to be processed with one another (not shown).

As shown in FIG. 1(D), the first introduction part d1 arranged in thesecond holder 21 in the apparatus in FIG. 1(A) can, similar to thesecond introduction part d2, be arranged in the second processingsurface 2 in place of the second holder 21. In this case, the opening ofthe first introduction part d1 is located at the upstream side from thesecond introduction part d2, that is, it is positioned nearer to therotation center than the second introduction part d2 in the secondprocessing surface 2.

In the apparatus shown in FIG. 1(D), the opening of the secondintroduction part d2 and the opening of the third introduction part d3both are arranged in the second processing surface 2 of the second ring20. However, arrangement of the opening of the introduction part is notlimited to such arrangement relative to the processing surface.Particularly as shown in FIG. 2(A), the opening of the secondintroduction part d2 can be arranged in a position adjacent to thesecond processing surface 2 in the inner periphery of the second ring20. In the apparatus shown in FIG. 2(A), the opening of the thirdintroduction part d3 is arranged in the second processing surface 2similarly to the apparatus shown in FIG. 1(B), but the opening of thesecond introduction part d2 can be arranged inside the second processingsurface 2 and adjacent to the second processing surface 2, whereby thesecond processed fluid can be immediately introduced onto the processingsurfaces.

In this manner, the opening of the first introduction part d1 isarranged in the second holder 21, and the opening of the secondintroduction part d2 is arranged inside the second processing surface 2and adjacent to the second processing surface 2 (in this case,arrangement of the third introduction part d3 is not essential), so thatparticularly in reaction of a plurality of fluids, the fluid introducedfrom the first introduction part d1 and the fluid introduced from thesecond introduction part d2 are introduced, without being reacted witheach other, into the space between the processing surfaces 1 and 2, andthen both the fluids can be reacted first between the processingsurfaces 1 and 2. Accordingly, the structure described above is suitablefor obtaining a particularly reactive fluid.

The term “adjacent” is not limited to the arrangement where the openingof the second introduction part d2 is contacted with the inner side ofthe second ring 20 as shown in FIG. 2(A). The distance between thesecond ring 20 and the opening of the second introduction part d2 may besuch a degree that a plurality of fluids are not completely mixed andreacted with one another prior to introduction into the space betweenthe processing surfaces 1 and 2. For example, the opening of the secondintroduction part d2 may be arranged in a position near the second ring20 of the second holder 21. Alternatively, the opening of the secondintroduction part d2 may be arranged on the side of the first ring 10 orthe first holder 11.

In the apparatus shown in FIG. 1(B), a gap is arranged between theopening of the third introduction part d3 and the opening of the secondintroduction part d2 in the radial direction of the second ring 20, butas shown in FIG. 2(B), the second and third fluids can be introducedinto the space between the processing surfaces 1 and 2, withoutproviding such gap, thereby immediately joining both the fluidstogether. The apparatus shown in FIG. 2(B) can be selected depending onthe object of processing.

In the apparatus shown in FIG. 1(D), a gap is also arranged between theopening of the first introduction part d1 and the opening of the secondintroduction part d2 in the radial direction of the second ring 20, butthe first and second fluids can be introduced into the space between theprocessing surfaces 1 and 2, without providing such gap, therebyimmediately joining both the fluids together. Such arrangement of theopening can be selected depending on the object of processing.

In the embodiment shown in FIG. 1(B) and FIG. 1(C), the opening of thethird introduction part d3 is arranged in the second processing surface2 downstream from the opening of the second introduction part d2, inother words, outside the opening of the second introduction part d2 inthe radial direction of the second ring 20. Alternatively, as shown inFIG. 2(C) and FIG. 3(A), the opening of the third introduction part d3and the opening of the second introduction part d2 can be arranged inthe second processing surface 2 in positions different in acircumferential direction r0 of the second ring 20. In FIG. 3, numeralm1 is the opening (first opening) of the first introduction part d1,numeral m2 is the opening (second opening) of the second introductionpart d2, numeral m3 is the opening (third opening) of the thirdintroduction part d3, and numeral r1 is the radical direction of thering.

When the first introduction part d1 is arranged in the second ring 20,as shown in FIG. 2(D), the opening of the first introduction part d1 andthe opening of the second introduction part d2 can be arranged in thesecond processing surface 2 in positions different in thecircumferential direction of the second ring 20.

In the apparatus shown in FIG. 2(C), the openings of two introductionparts are arranged in the second processing surface 2 of the second ring20 in positions different in the circumferential direction r0, but asshown in FIG. 3(B), the openings of three introduction parts can bearranged in positions different in the circumferential direction r0 ofthe ring, or as shown in FIG. 3(C), the openings of four introductionparts can be arranged in positions different in the circumferentialdirection r0 of the ring. In FIG. 3(B) and FIG. 3(C), numeral m4 is theopening of the fourth introduction part, and in FIG. 3(C), numeral m5 isthe opening of the fifth introduction part. Five or more openings ofintroduction parts may be arranged in positions different in thecircumferential direction r0 of the ring (not shown).

In the apparatuses shown in FIG. 2(B), FIG. 2(D) and in FIG. 3(A) toFIG. 3(C), the second to fifth introduction parts can introducedifferent fluids, that is, the second, third, fourth and fifth fluids.On the other hand, the second to fifth openings m2 to m5 can introducethe same fluid, that is, the second fluid into the space between theprocessing surfaces. In this case, the second to fifth introductionparts are connected to the inside of the ring and can be connected toone fluid feed part, that is, the second fluid feed part p2 (not shown).

A plurality of openings of introduction parts arranged in positionsdifferent in the circumferential direction r0 of the ring can becombined with a plurality of openings of introduction parts arranged inpositions different in the radial direction r1 of the ring.

For example, as shown in FIG. 3(D), the openings m2 to m9 of eightintroduction parts are arranged in the second processing surface 2,wherein four openings m2 to m5 of them are arranged in positionsdifferent in the circumferential direction r0 of the ring and identicalin the radial direction r1 of the ring, and the other four openings m6to m9 are arranged in positions different in the circumferentialdirection r0 of the ring and identical in the radial direction r1 of thering. Then, the other openings m6 to m9 are arranged outside the radialdirection r1 of the four openings m2 to m5. The outside openings andinside openings may be arranged in positions identical in thecircumferential direction r0 of the ring, but in consideration ofrotation of the ring, may be arranged in positions different in thecircumferential direction r0 of the ring as shown in FIG. 3(D). In thiscase too, the openings are not limited to arrangement and number shownin FIG. 3(D).

For example, as shown in FIG. 3(E), the outside opening in the radialdirection can be arranged in the apex of a polygon, that is, in the apexof a rectangle in this case, and the inside opening in the radialdirection can be positioned on one side of the rectangle. As a matter ofcourse, other arrangements can also be used.

When the openings other than the first opening m1 feed the second fluidinto the space between the processing surfaces, each of the openings maybe arranged as continuous openings in the circumferential direction r0as shown in FIG. 3(F), instead of being arranged discretely in thecircumferential direction r0 of the processing surface.

As shown in FIG. 4(A), depending on the object of processing, the secondintroduction part d2 arranged in the second ring 20 in the apparatusshown in FIG. 1(A) can be, similar to the first introduction part d1,arranged in the central portion 22 of the second holder 21. In thiscase, the opening of the second introduction part d2 is positioned witha gap outside the opening of the first introduction part d1 positionedin the center of the second ring 20. As shown in FIG. 4(B), in theapparatus shown in FIG. 4(A), the third introduction part d3 can bearranged in the second ring 20. As shown in FIG. 4(C), in the apparatusshown in FIG. 4(A), the first and second fluids can be introduced intothe space inside the second ring 20 without arranging a gap between theopening of the first introduction part d1 and the opening of the secondintroduction part d2, so that both the fluids can immediately jointogether. As shown in FIG. 4(D), depending on the object of processing,in the apparatus shown in FIG. 4(A), the third introduction part d3 canbe, similar to the second introduction part d2, arranged in the secondholder 21. Four or more introduction parts may be arranged in the secondholder 21 (not shown).

As shown in FIG. 5(A), depending on the object of processing, in theapparatus shown in FIG. 4(D), the fourth introduction part d4 can bearranged in the second ring 20, so that the fourth fluid may beintroduced into the space between the processing surfaces 1 and 2.

As shown in FIG. 5(B), in the apparatus shown in FIG. 1(A), the secondintroduction part d2 can be arranged in the first ring 10, and theopening of the second introduction part d2 can be arranged in the firstprocessing surface 1.

As shown in FIG. 5(C), in the apparatus shown in FIG. 5(B), the thirdintroduction part d3 can be arranged in the first ring 10, and theopening of the third introduction part d3 and the opening of the secondintroduction part d2 can be arranged in the first processing surface 1in positions different in the circumferential direction of the firstring 10.

As shown in FIG. 5(D), in the apparatus shown in FIG. 5(B), the firstintroduction part d1 can be arranged in the second ring 20 instead ofarranging the first introduction part d1 in the second holder 21, andthe opening of the first introduction part d1 can be arranged in thesecond processing surface 2. In this case, the openings of the first andsecond introduction parts d1 and d2 are arranged in positions identicalin the radial direction of the ring.

As shown in FIG. 6(A), in the apparatus shown in FIG. 1(A), the thirdintroduction part d3 can be arranged in the first ring 10, and theopening of the third introduction part d3 can be arranged in the firstprocessing surface 1. In this case, both the openings of the second andthird introduction parts d2 and d3 are arranged in positions identicalin the radial direction of the ring. However, both the openings may bearranged in positions different in the radial direction of the ring.

In the apparatus shown in FIG. 5(C), the openings of the second andthird introduction parts d2 and d3 are arranged in positions identicalin the radial direction of the first ring 10 and simultaneously arrangedin positions different in the circumferential direction (that is,rotation direction) of the first ring 10, but in this apparatus, asshown in FIG. 6(B), both the openings of the second and thirdintroduction parts d2 and d3 can be arranged in positions different inthe radical direction of the first ring 10. In this case, as shown inFIG. 6(B), a gap can be arranged between both the openings of the secondand third introduction parts d2 and d3 in the radial direction of thefirst ring 10, or without arranging the gap, the second and third fluidsmay immediately join together (not shown).

As shown in FIG. 6(C), the first introduction part d1 together with thesecond introduction part d2 can be arranged in the first ring 10 insteadof arranging the first introduction part d1 in the second holder 21. Inthis case, in the first processing surface 1, the opening of the firstintroduction part d1 is arranged upstream (inside the radial directionof the first ring 10) from the opening of the second introduction partd2. A gap is arranged between the opening of the first introduction partd1 and the opening of the second introduction part d2 in the radialdirection of the first ring 10. Alternatively, such gap may not bearranged (not shown).

As shown in FIG. 6(D), both the openings of the first introduction partd1 and the second introduction part d2 can be arranged in positionsdifferent in the circumferential direction of the first ring 10 in thefirst processing surface 1 in the apparatus shown in FIG. 6(C).

In the embodiment shown in FIG. 6(C) and FIG. 6(D), three or moreintroduction parts may be arranged in the first ring 10, and in thesecond processing surface 2, so the respective openings may be arrangedin positions different in the circumferential direction or in positionsdifferent in the radial direction of the ring (not shown). For example,the arrangement of openings in the second processing surface 2, shown inFIG. 3(B) to FIG. 3(F), can also be used in the first processing surface1.

As shown in FIG. 7(A), in the apparatus shown in FIG. 1(A), the secondintroduction part d2 can be arranged in the first holder 11 instead ofarranging the part d2 in the second ring 20. In this case, the openingof the second introduction part d2 is arranged preferably in the centerof the central shaft of rotation of the first ring 10, in the sitesurrounded with the first ring 10 on the upper surface of the firstholder 11.

As shown in FIG. 7(B), in the embodiment shown in FIG. 7(A), the thirdintroduction part d3 can be arranged in the second ring 20, and theopening of the third introduction part d3 can be arranged in the secondprocessing surface 2.

As shown in FIG. 7(C), the first introduction part d1 can be arranged inthe first holder 11 instead of arranging the part d1 in the secondholder 21. In this case, the opening of the first introduction part d1is arranged preferably in the central shaft of rotation of the firstring 10, in the site surrounded with the first ring 10 on the uppersurface of the first holder 11. In this case, as shown in the figure,the second introduction part d2 can be arranged in the first ring 10,and its opening can be arranged in the first processing surface 1. Inthis case, the second introduction part d2 can be arranged in the secondring 20, and its opening can be arranged in the second processingsurface 2 (not shown).

As shown in FIG. 7(D), the second introduction part d2 shown in FIG.7(C) together with the first introduction part d1 can be arranged in thefirst holder 11. In this case, the opening of the second introductionpart d2 is arranged in the site surrounded with the first ring 10 on theupper surface of the first holder 11. In this case, the secondintroduction part d2 arranged in the second ring 20 may serve as thethird introduction part d3 in FIG. 7(C).

In the embodiments shown in FIG. 1 to FIG. 7, the first holder 11 andthe first ring 10 are rotated relative to the second holder 21 and thesecond ring 20, respectively. As shown in FIG. 8(A), in the apparatusshown in FIG. 1(A), the second holder 21 may be provided with a rotaryshaft 51 rotating with the turning force from the rotation drive member,to rotate the second holder 21 in a direction opposite to the firstholder 11. The rotation drive member may be arranged separately from theone for rotating the rotary shaft 50 of the first holder 11 or mayreceive power from the drive part for rotating the rotary shaft 50 ofthe first holder 11 by a power transmission means such as a gear. Inthis case, the second holder 21 is formed separately from the case, andshall, like the first holder 11, be rotatably accepted in the case.

As shown in FIG. 8(B), in the apparatus shown in FIG. 8(A), the secondintroduction part d2 can be, similarly in the apparatus in FIG. 7(B),arranged in the first holder 11 in place of the second ring 20.

In the apparatus shown in FIG. 8(B), the second introduction part d2 canbe arranged in the second holder 21 in place of the first holder 11 (notshown). In this case, the second introduction part d2 is the same as onein the apparatus in FIG. 4(A). As shown in FIG. 8(C), in the apparatusshown in FIG. 8(B), the third introduction part d3 can be arranged inthe second ring 20, and the opening of the third introduction part d3can be arranged in the second processing surface 2.

As shown in FIG. 8(D), the second holder 21 only can be rotated withoutrotating the first holder 11. Even in the apparatuses shown in FIG. 1(B)to FIG. 7, the second holder 21 together with the first holder 11, orthe second holder 21 alone, can be rotated (not shown).

As shown in FIG. 9(A), the second processing member 20 is a ring, whilethe first processing member 10 is not a ring and can be a rotatingmember provided directly with a rotary shaft 50 similar to that of thefirst holder 11 in other embodiments. In this case, the upper surface ofthe first processing member 10 serves as the first processing surface 1,and the processing surface is an evenly flat surface which is notcircular (that is, hollow-free). In the apparatus shown in FIG. 9(A),similarly in the apparatus in FIG. 1(A), the second introduction part d2is arranged in the second ring 20, and its opening is arranged in thesecond processing surface 2.

As shown in FIG. 9(B), in the apparatus shown in FIG. 9(A), the secondholder 21 provided with the second ring 20 is independent of the case 3,and a surface-approaching pressure imparting mechanism 4 such as anelastic body for approaching to and separating from the first processingmember 10 can be provided between the case 3 and the second holder 21.In this case, as shown in FIG. 9(C), the second processing member 20 isnot a ring, but is a member corresponding to the second holder 21, andthe lower surface of the member can serve as the second processingsurface 2. As shown in FIG. 10(A), in the apparatus shown in FIG. 9(C),the first processing member 10 is not a ring either, and in otherembodiments similarly in the apparatus shown in FIG. 9(A) and FIG. 9(B),the site corresponding to the first holder 11 can serve as the firstprocessing member 10, and its upper surface can serve as the firstprocessing surface 1.

In the embodiments described above, at least the first fluid is suppliedfrom the first processing member 10 and the second processing member 20,that is, from the central part of the first ring 10 and the second ring20, and after processing (mixing and reaction) of the other fluids, theprocessed fluid is discharged to the outside in the radial direction.Alternatively, as shown in FIG. 10(B), the first fluid can be suppliedin the direction from the outside to the inside of the first ring 10 andsecond ring 20. In this case, the outside of the first holder 11 and thesecond holder 21 is sealed with the case 3, the first introduction partd1 is arranged directly in the case 3, and the opening of theintroduction part is arranged in a site inside the case andcorresponding to the abutting position of the rings 10 and 20, as shownin the figure. In the apparatus in FIG. 1(A), a discharge part 36 isarranged in the position in which the first introduction part d1 isarranged, that is, in the central position of the ring 1 of the firstholder 11. The opening of the second introduction part d2 is arranged inthe opposite side of the opening of the case behind the central shaft ofrotation of the holder. However, the opening of the second introductionpart d2 may be, similar to the opening of the first introduction partd1, arranged in a site inside the case and corresponding to the abuttingposition of the rings 10 and 20. As described above, the embodiment isnot limited to the one where the opening of the second introduction partd2 is formed to the opposite side of the opening of the firstintroduction part d1.

In this case, the outside of the diameter of both rings 10 and 20 is onthe upstream side, and the inside of both the rings 10 and 20 is on thedownstream side.

As such, as shown in FIG. 16(E), when the processed fluid moves fromoutside to inside, the first processing surface 1 of the firstprocessing member 10 may also be provided with groove-like depressions13 . . . 13 extending in the direction from outside to inside of thefirst processing member 10. When the groove-like depressions 13 . . . 13are formed, the balance ratio K described above is preferably set as100% or more of unbalance type. As a result, dynamical pressure isgenerated in the groove-like depressions 13 . . . 13 upon rotating, thefirst and second processing surfaces 1 and 2 can rotate in a surelynon-contact state, so that the risk of abrasion and the like due tocontact can be eliminated. In the embodiment shown in FIG. 16(E), theseparating force due to the pressure of the processed fluid is generatedin an inner end 13 a of the depressions 13.

As shown in FIG. 10(C), in the apparatus shown in FIG. 10(B), the secondintroduction part d2, which is arranged in the side of the case 3, canbe arranged in the first ring 10 in space of the mentioned position, andits opening can be arranged in the first processing surface 1. In thiscase, as shown in FIG. 10(D), the first processing member 10 is notformed as a ring. Similarly in the apparatuses shown in FIG. 9(A), FIG.9(B), and FIG. 10(A), in other embodiments, the site corresponding tothe first holder 11 is the first processing member 10, its upper surfacebeing the first processing surface 1, the second introduction part d2being arranged in the first processing member 10, and its opening may bearranged in the first processing surface 1.

As shown in FIG. 11(A), in the apparatus shown in FIG. 10(D), the secondprocessing member 20 is not formed as a ring, and in other embodiments,the member corresponding to the second holder 21 serves as the secondprocessing member 20, and its lower surface serves as the secondprocessing surface 2. Then, the second processing member 20 is a memberindependent of the case 3, and the same surface-approaching pressureimparting mechanism 4 as one in the apparatuses shown in FIG. 9(B), FIG.9(C), and FIG. 10(A) can be arranged between the case 3 and the secondprocessing member 20.

As shown in FIG. 11(B), the second introduction part d2 in the apparatusshown in FIG. 11(A) serves as the third introduction part d3, andseparately the second introduction part d2 can be arranged. In thiscase, the opening of the second introduction part d2 is arrangeddownstream from the opening of the third introduction part d3 in thesecond processing surface 2.

In the apparatuses shown in FIG. 4 and the apparatuses shown in FIG.5(A), FIG. 7(A), FIG. 7(B), FIG. 7(D), FIG. 8(B) and FIG. 8(C), otherfluids to be processed flow into the first fluid before reaching theprocessing surfaces 1 and 2, and these apparatuses are not suitable forthe fluid which is rapidly crystallized or separated. However, theseapparatuses can be used for the fluid having a low reaction speed.

The processing apparatus suitable for carrying out the method accordingto the present invention is summarized as follows.

As described above, the processing apparatus comprises a fluid pressureimparting mechanism that imparts predetermined pressure to a fluid to beprocessed, at least two processing members, that is, a first processingmember 10 arranged in a sealed fluid flow path through which the fluidat the predetermined pressure flows and a second processing member 20capable of approaching to and separating from the first processingmember 10, at least two processing surfaces of a first processingsurface 1 and a second processing surface 2 arranged in a position inwhich they are faced with each other in the processing members 10 and20, and a rotation drive mechanism that relatively rotates the firstprocessing member 10 and the second processing member 20, wherein atleast two fluids to be processed are mixed and reacted between theprocessing surfaces 1 and 2. Of the first processing member 10 and thesecond processing member 20, at least the second processing member 20has a pressure-receiving surface, at least a part of thepressure-receiving surface is comprised of the second processing surface2, and the pressure-receiving surface receives pressure applied by thefluid pressure imparting mechanism to at least one of the fluids togenerate a force to move in the direction of separating the secondprocessing surface 2 from the first processing surface 1. In thisapparatus, the fluid that has received said pressure passes through thespace between the first processing surface 1 and the second processingsurface 2 capable of approaching to and separating from each other,thereby generating a desired reaction between the processed fluids withthe fluids being passed between the processing surfaces 1 and 2 andforming a thin film fluid of predetermined thickness.

In this processing apparatus, at least one of the first processingsurface 1 and the second processing surface 2 is preferably providedwith a buffer mechanism for regulation of micro-vibration and alignment.

In this processing apparatus, one of or both the first processingsurface 1 and the second processing surface 2 is preferably providedwith a displacement regulating mechanism capable of regulating thedisplacement in the axial direction caused by abrasion or the likethereby maintaining the thickness of a thin film fluid between theprocessing surfaces 1 and 2.

In this processing apparatus, a pressure device such as a compressor forapplying predetermined feeding pressure to a fluid can be used as thefluid pressure imparting mechanism.

As the pressure device, a device capable of regulating an increase anddecrease in feeding pressure is used. This is because the pressuredevice should be able to keep established pressure constant and shouldbe able to regulate an increase and decrease in feeding pressure as aparameter to regulate the distance between the processing surfaces.

The processing apparatus can be provided with a separation preventingpart for defining the maximum distance between the first processingsurface 1 and the second processing surface 2 and preventing theprocessing surfaces 1 and 2 from separating from each other by themaximum distance or more.

The processing apparatus can be provided with an approach preventingpart for defining the minimum distance between the first processingsurface 1 and the second processing surface 2 and preventing theprocessing surfaces 1 and 2 from approaching to each other by theminimum distance or less.

The processing apparatus can be one wherein both the first processingsurface 1 and the second processing surface 2 are rotated in oppositedirections.

The processing apparatus can be provided with a temperature-regulatingjacket for regulating the temperature of either or both of the firstprocessing surface 1 and the second processing surface 2.

The processing apparatus is preferably one wherein at least a part ofeither or both of the first processing surface 1 and the secondprocessing surface 2 is mirror-polished.

The processing apparatus can be one wherein one of or both the firstprocessing surface 1 and the second processing surface 2 is providedwith depressions.

The processing apparatus preferably includes, as a means for feeding onefluid to be reacted with another fluid, a separate introduction pathindependent of a path for another fluid, at least one of the firstprocessing surface and the second processing surface is provided with anopening leading to the separate introduction path, and another fluidsent through the separate introduction path is introduced into the onefluid.

The processing apparatus for carrying out the present inventioncomprises a fluid pressure imparting mechanism that impartspredetermined pressure to a fluid to be processed, at least twoprocessing surfaces of a first processing surface 1 and a secondprocessing surface 2 capable of approaching to and separating from eachother which are connected to a sealed fluid flow path through which thefluid at the predetermined pressure is passed, a surface-approachingpressure imparting mechanism that imparts surface-approaching pressureto the space between the processing surfaces 1 and 2, and a rotationdrive mechanism that relatively rotates the first processing surface 1and the second processing surface 2, wherein at least two fluids to beprocessed are reacted between the processing surfaces 1 and 2, at leastone fluid pressurized with the fluid pressure imparting mechanism ispassed through the space between the first processing surface 1 and thesecond processing surface 2 rotating to each other and supplied withsurface-approaching pressure, and another fluid is passed, so that thefluid pressurized with the fluid pressure imparting mechanism, whilebeing passed between the processing surfaces and forming a thin filmfluid of predetermined thickness, is mixed with another fluid, whereby adesired reaction is caused between the fluids.

The surface-approaching pressure imparting mechanism can constitute abuffer mechanism of regulating micro-vibration and alignment and adisplacement regulation mechanism in the apparatus described above.

The processing apparatus for carrying out the present inventioncomprises a first introduction part that introduces, into the apparatus,at least one of two fluids to be reacted, a fluid pressure impartingmechanism p that is connected to the first introduction part and impartspressure to a fluid to be processed, a second introduction part thatintroduces at least the other fluid of the two fluids to be reacted, atleast two processing members, that is, a first processing member 10arranged in a sealed fluid flow path through which the other fluid ispassed and a second processing member 20 capable of relativelyapproaching to and separating from the first processing member 10, atleast two processing surfaces, that is, a first processing surface 1 anda second processing surface 2 arranged so as to be opposite to eachother in the processing members 10 and 20, a holder 21 that accepts thesecond processing member 20 so as to expose the second processingsurface 2, a rotation drive mechanism that relatively rotates the firstprocessing member 10 and the second processing member 20, and asurface-approaching pressure imparting mechanism 4 that presses thesecond processing member 20 against the first processing surface 1 suchthat the second processing surface 2 is contacted against or made closeto the first processing surface 1, wherein the fluids to be processedare reacted between the processing surfaces 1 and 2, the holder 21 isprovided with an opening of the first introduction part and is notmovable so as to influence the space between the processing surfaces 1and 2, at least one of the first processing member 10 and the secondintroduction part 20 is provided with an opening of the secondintroduction part, the second processing member 20 is circular, thesecond processing surface 2 slides along the holder 21 and approaches toand separates from the first processing surface 1, the second processingmember 20 includes a pressure-receiving surface, the pressure-receivingsurface receives pressure applied by the fluid pressure impartingmechanism p1 to the fluid to generate a force to move in the directionof separating the second processing surface 2 from the first processingsurface 1, at least a part of the pressure-receiving surface iscomprised of the second processing surface 2, one of the fluids to whichpressure was applied is passed through the space between the firstprocessing surface 1 and the second processing surface 2 rotating toeach other and capable of approaching to and separating from each other,and the other fluid is supplied to the space between the processingsurfaces 1 and 2, whereby both the fluids form a thin film fluid ofpredetermined thickness and pass through the space between both theprocessing surfaces 1 and 2, the passing fluids are mixed therebypromoting a desired reaction between the processed fluids, and theminimum distance for generating the thin film fluid of predeterminedthickness is kept between the processing surfaces 1 and 2 by the balancebetween the surface-approaching pressure by the surface-approachingpressure imparting mechanism 4 and the force of separating theprocessing surfaces 1 and 2 from each other by the fluid pressureimparted by the fluid pressure imparting mechanism p1.

In this processing apparatus, the second introduction part can be,similarly being connected to the first introduction part, arranged to beconnected to a separate fluid pressure imparting mechanism and to bepressurized. The fluid introduced from the second introduction part isnot pressurized by the separate fluid pressure imparting mechanism, butis sucked and supplied into the space between the processing surfaces 1and 2 by negative pressure generated in the second introduction part bythe fluid pressure of the fluid introduced into the first introductionpart. Alternatively, the other fluid flows downward by its weight in thesecond introduction part and can be supplied into the space between theprocessing surfaces 1 and 2.

As described above, the apparatus is not limited to the one wherein theopening of the first introduction part as an inlet for feeding the otherfluid to be processed into the apparatus is arranged in the secondholder, and the opening of the first introduction part may be arrangedin the first holder. The opening of the first introduction part may beformed with at least one of the processing surfaces. However, when thefluid to be previously introduced into the space between the processingsurfaces 1 and 2 should, depending on the reaction, be supplied from thefirst introduction part, the opening of the second introduction part asan inlet for feeding the other fluid into the apparatus should bearranged downstream from the opening of the first introduction part inany of the processing surfaces.

As the processing apparatus for carrying out the present invention, thefollowing apparatus can be used.

This processing apparatus comprises a plurality of introduction partsthat separately introduce two or more fluids to be reacted, a fluidpressure imparting mechanism p that imparts pressure to at least one ofthe two or more fluids, at least two processing members, that is, afirst processing member 10 arranged in a sealed fluid flow path throughwhich the processed fluid is passed and a second processing member 20capable of approaching to and separating from the first processingmember 10, at least two processing surfaces 1 and 2, that is, a firstprocessing surface 1 and a second processing surface 2 arranged in aposition in which they are faced with each other in the processingmembers 10 and 20, and a rotation drive mechanism that relativelyrotates the first processing member 10 and the second processing member20, wherein the fluids are reacted between the processing surfaces 1 and2, at least the second processing member 20 of the first processingmember 10 and the second processing member 20 includes apressure-receiving surface, at least a part of the pressure-receivingsurface is comprised of the second processing surface 2, thepressure-receiving surface receives pressure applied by the fluidpressure imparting mechanism to the fluid to generate a force to move inthe direction of separating the second processing surface 2 from thefirst processing surface 1, the second processing member 20 includes anapproach regulating surface 24 that is directed to the opposite side ofthe second processing surface 2, the approach regulating surface 24receives predetermined pressure applied to the fluid to generate a forceto move in the direction of approaching the second processing surface 2to the first processing surface 1, a force to move in the direction ofseparating the second processing surface 2 from the first processingsurface 1 as a resultant force of total pressure received from the fluidis determined by the area ratio of the projected area of the approachregulating surface 24 in the approaching and separating direction to theprojected area of the pressure-receiving surface in the approaching andseparating direction, the fluid to which pressure was applied is passedthrough the space between the first processing surface 1 and the secondprocessing surface 2 that rotate relative to each other and capable ofapproaching to and separating from each other, the other fluid to bereacted with the one fluid is mixed in the space between the processingsurfaces, and the mixed fluid forms a thin film fluid of predeterminedthickness and simultaneously passes through the space between theprocessing surfaces 1 and 2, thereby giving a desired reaction productwhile passing through the space between the processing surfaces.

The processing method according to the present invention is summarizedas follows. The processing method comprises applying predeterminedpressure to a first fluid, connecting at least two processing surfaces,that is, a first processing surface 1 and a second processing surface 2,which are capable of approaching to and separating from each other, to asealed fluid flow path through which the fluid that has received thepredetermined pressure is passed, applying a surface-approachingpressure of approaching the first processing surface 1 and the secondprocessing surface 2 each other, rotating the first processing surface 1and the second processing surface 2 relative to each other, andintroducing the fluid into the space between the processing surfaces 1and 2, wherein the second fluid to be reacted with the first fluid isintroduced through a separate flow path into the space between theprocessing surfaces 1 and 2 thereby reacting both the fluids, thepredetermined pressure applied to at least the first fluid functions asa separating force for separating the processing surfaces 1 and 2 fromeach other, and the separating force and the surface-approachingpressure are balanced via the fluid between the processing surfaces 1and 2, whereby the distance between the processing surfaces 1 and 2 iskept in a predetermined minute space, the fluid is passed as a thin filmfluid of predetermined thickness through the space between theprocessing surfaces 1 and 2, and when both the fluids are uniformlyreacted with each other while passing and accompanied by separation, adesired reaction product is crystallized or separated.

Hereinafter, other embodiments of the present invention are described indetail. FIG. 25 is a schematic sectional view of a reaction apparatuswherein reactants are reacted between processing surfaces, at least oneof which rotates relative to the other, and which are capable ofapproaching to and separating from each other. FIG. 26(A) is a schematicplane view of the first processing surface in the apparatus shown inFIG. 25, and FIG. 26(B) is an enlarged view of an important part of theprocessing surface in the apparatus shown in FIG. 25. FIG. 27(A) is asectional view of the second introduction path, and FIG. 27(B) is anenlarged view of an important part for explaining the secondintroduction path.

In FIG. 25, arrows U and S show upward and downward directionsrespectively.

In FIG. 26(A) and FIG. 27(B), arrow R shows the direction of rotation.

In FIG. 27(B), arrow C shows the direction of centrifugal force (radialdirection).

This apparatus uses at least two fluids as a fluid to be processed thatis described above, at least one of which contains at least one kind ofreactant, and the fluids join together in the space between theprocessing surfaces arranged to be opposite so as to able to approach toand separate from each other, at least one of which rotates relative tothe other, thereby forming a thin film fluid, and the reactants arereacted in the thin film fluid.

As shown in FIG. 25, this apparatus includes a first holder 11, a secondholder 21 arranged over the first holder 11, a fluid pressure impartingmechanism P and a surface-approaching pressure imparting mechanism. Thesurface-approaching pressure imparting mechanism is comprised of aspring 43 and an air introduction part 44.

The first holder 11 is provided with a first processing member 10 and arotary shaft 50. The first processing member 10 is a circular bodycalled a mating ring and provided with a mirror-polished firstprocessing surface 1. The rotary shaft 50 is fixed to the center of thefirst holder 11 with a fixing device 81 such as a bolt and is connectedat its rear end to a rotation drive device 82 (rotation drive mechanism)such as a motor, and the drive power of the rotation drive device 82 istransmitted to the first holder 1 thereby rotating the first holder 11.The first processing member 10 is integrated with the first holder 11and rotated.

A receiving part capable of receiving the first processing member 10 isarranged on the upper part of the first holder 11, wherein the firstprocessing member 10 has been fixed to the first holder 11 by insertionto the receiving part. The first processing member 10 has been fixedwith a rotation-preventing pin 83 so as not to be rotated relative tothe first holder 11. However, a method such as fitting by burning may beused for fixing in place of the rotation-preventing pin 83 in order toprevent rotation.

The first processing surface 1 is exposed from the first holder 11 andfaced with the second holder 21. The material for the first processingsurface includes ceramics, sintered metal, abrasion-resistant steel,other hardened metals, and rigid materials subjected to lining, coatingor plating.

The second holder 21 is provided with a second processing member 20, afirst introduction part d1 for introducing a fluid from the inside ofthe processing member, a spring 43 as a surface-approaching pressureimparting mechanism, and an air introduction part 44.

The second processing member 20 is a circular member called acompression ring and includes a second processing surface 2 subjected tomirror polishing and a pressure-receiving surface 23 (referred tohereinafter as separation regulating surface 23) which is located insidethe second processing surface 2 and adjacent to the second processingsurface 2. As shown in the figure, the separation regulating surface 23is an inclined surface. The method of the mirror polishing to which thesecond processing surface 2 was subjected is the same as that to thefirst processing surface 1. The material for the second processingmember 20 may be the same as one for the first processing member 10. Theseparation regulating surface 23 is adjacent to the inner periphery 25of the circular second processing member 20.

A ring-accepting part 41 is formed in the bottom (lower part) of thesecond holder 21, and the second processing member 20 together with anO-ring is accepted in the ring-accepting part 41. The second processingmember 20 is accepted with a rotation preventive 84 so as not to berotated relative to the second holder 21. The second processing surface2 is exposed from the second holder 21. In this state, the secondprocessing surface 2 is faced with the first processing surface 1 of thefirst processing member 10.

The ring-accepting part 41 arranged in the second holder 21 is adepression for mainly accepting that side of the second ring 20 which isopposite to the processing surface 2 and is a groove formed in acircular form when viewed in a plane.

The ring-accepting part 41 is formed in a larger size than the secondring 20 and accepts the second ring 20 with sufficient clearance betweenitself and the second ring 20.

By this clearance, the second processing member 20 is accepted in thering-accepting part 41 such that it can be displaced not only in theaxial direction of the accepting part 41 but also in a directionperpendicular to the axial direction. The second processing member 20 isaccepted in the ring-accepting part 41 such that the central line (axialdirection) of the second processing member 20 can be displaced so as notto be parallel to the axial direction of the ring-accepting part 41.

The spring 43 is arranged as a processing member-biasing part in atleast the ring-accepting part 41 of the second holder 21. The spring 43biases the second processing member 20 toward the first processingmember 10. As another bias method, air pressure such as one in the airintroduction part 44 or another pressurization means for applying fluidpressure may be used to bias the second processing member 20 held by thesecond holder 21 in the direction of approaching the second processingmember 20 to the first processing member 10.

The surface-approaching pressure imparting mechanism such as the spring43 or the air introduction part 44 biases each position (each positionin the processing surface) in the circumferential direction of thesecond processing member 20 evenly toward the first processing member10. The first introduction part d1 is arranged on the center of thesecond holder 21, and the fluid which is pressure-fed from the firstintroduction part d1 to the outer periphery of the processing member isfirst introduced into the space surrounded with the second processingmember 20 held by the second holder 21, the first processing member 10,and the first holder 11 that holds the first processing member 10. Then,the feeding pressure (supply pressure) of the fluid by the fluidpressure imparting mechanism P is applied to the pressure-receivingsurface 23 arranged in the second processing member 20, in the directionof separating the second processing member 20 from the first processingmember 10 against the bias of the biasing part.

For simplifying the description of other components, only thepressure-receiving surface 23 is described, and as shown in FIG. 29(A)and FIG. 29(B), properly speaking, together with the pressure-receivingsurface 23, apart 23X not provided with the pressure-receiving surface23, out of the projected area in the axial direction relative to thesecond processing member 20 in a grooved depression 13 described later,serves as a pressure-receiving surface and receives the feeding pressure(supply pressure) of the fluid by the fluid pressure imparting mechanismP.

The apparatus may not be provided with the pressure-receiving surface23. In this case, as shown in FIG. 26(A), the effect (micro-pump effect)of introduction of the fluid to be processed into the space between theprocessing surfaces formed by rotation of the first processing surface 1provided with the grooved depression 13 formed to function thesurface-approaching pressure imparting mechanism may be used. Themicro-pump effect is an effect by which the fluid in the depressionadvances with speed toward the end in the circumferential direction byrotation of the first processing surface 1 and then the fluid sent tothe end of the depression 13 further receives pressure in the directionof inner periphery of the depression 13 thereby finally receivingpressure in the direction of separating the processing surface andsimultaneously introducing the fluid into the space between theprocessing surfaces. Even if the first processing surface 1 is notrotated, the pressure applied to the fluid in the depression 13 arrangedin the first processing surface 1 finally acts on the second processingsurface 2 to be separated as a pressure-receiving surface.

For the depression 13 arranged on the processing surface, its total areain the horizontal direction relative to the processing surface, and thedepth, number, and shape of depressions, can be established depending onthe physical properties of a fluid containing reactants and reactionproducts.

The pressure-receiving surface 23 and the depression 13 may be arrangedin the same apparatus.

The depression 13 is a depression having a depth of 1 μm to 50 μm,preferably 3 μm to 20 μm, which is arranged on the processing surface,the total area thereof in the horizontal direction is 5% to 50%,preferably 15% to 25%, based on the whole of the processing surface, thenumber of depressions is 3 to 50, preferably 8 to 24, and the depressionextends in a curved or spiral form on the processing surface or bends ata right angle. By having depth changing continuously, fluids with highto low viscosity, even containing solids, can be introduced into thespace between the processing surfaces stably by the micro-pump effect.The depressions arranged on the processing surface may be connected toone another or separated from one another in the side of introduction,that is, inside the processing surface.

As described above, the pressure-receiving surface 23 is inclined. Thisinclined surface (pressure-receiving surface 23) is formed such that thedistance in the axial direction between the upstream end in thedirection of flow of the fluid and the processing surface of theprocessing member provided with the depression 13 is longer than thedistance between the downstream end and the aforesaid processingsurface. The downstream end of this inclined surface in the direction offlow of the fluid is arranged preferably on the projected area in theaxial direction of the depression 13.

Specifically, as shown in FIG. 28(A), a downstream end 60 of theinclined surface (pressure-receiving surface 23) is arranged on theprojected area in the axial direction of the depression 13. The angle θ1of the inclined surface to the second processing surface 2 is preferablyin the range of 0.1° to 85°, more preferably in the range of 10° to 55°,still more preferably in the range of 15° to 45°. The angle θ1 can varydepending on properties of the product before processing. The downstreamend 60 of the inclined surface is arranged in the region extending fromthe position apart downstream by 0.01 mm from an upstream end 13-b tothe position apart upstream by 0.5 mm from a downstream end 13-c in thedepression 13 arranged in the first processing surface 1. The downstreamend 60 of the inclined surface is arranged more preferably in the regionextending from the position apart downstream by 0.05 mm from theupstream end 13-b to the position apart upstream by 1.0 mm from thedownstream end 13-c. Like the angle of the inclined surface, theposition of the downstream end 60 can vary depending on properties of amaterial to be processed. As shown in FIG. 28(B), the inclined surface(pressure-receiving surface 23) can be a curved surface. The material tobe processed can thereby be introduced more uniformly.

The depressions 13 may be connected to one another or separated from oneanother as described above. When the depressions 13 are separated, theupstream end at the innermost peripheral side of the first processingsurface 1 is 13-b, and the upstream end at the outermost peripheral sideof the first processing surface 1 is 13-c.

In the foregoing description, the depression 13 was formed on the firstprocessing surface 1 and the pressure-receiving surface 23 was formed onthe second processing surface 2. On the contrary, the depression 13 maybe formed on the second processing surface 2, and the pressure-receivingsurface 23 may be formed on the first processing surface 1.

Alternatively, the depression 13 is formed both on the first processingsurface 1 and the second processing surface 2, and the depression 13 andthe pressure-receiving surface 23 are alternately arranged in thecircumferential direction of each of the respective processing surfaces1 and 2, whereby the depression 13 formed on the first processingsurface 1 and the pressure-receiving surface 23 formed on the secondprocessing surface 2 are faced with each other and simultaneously thepressure-receiving surface 23 formed on the first processing surface 1and the depression 13 formed on the second processing surface 2 arefaced with each other.

A groove different from the depression 13 can be formed on theprocessing surface. Specifically, as shown in FIG. 16(F) and FIG. 16(G),a radially extending novel depression 14 instead of the depression 13can be formed outward in the radial direction (FIG. 16(F)) or inward inthe radial direction (FIG. 16(G)). This is advantageous for prolongationof retention time between the processing surfaces or for processing ahighly viscous fluid.

The groove different from the depression 13 is not particularly limitedwith respect to the shape, area, number of depressions, and depth. Thegroove can be formed depending on the object.

The second introduction part d2 independent of the fluid flow pathintroduced into the processing surface and provided with the opening d20leading to the space between the processing surfaces is formed on thesecond processing member 20.

Specifically, as shown in FIG. 27(A), the direction of introduction ofthe second introduction part d2 from the opening d20 of the secondprocessing surface 2 is inclined at a predetermined elevation angle (θ1)relative to the second processing surface 2. The elevation angle (θ1) isarranged at more than 0° and less than 90°, and when the reaction speedis high, the angle (θ1) is preferably arranged at 1° to 45°.

As shown in FIG. 27(B), the direction of introduction of the secondprocessing surface 2 from the opening d20 has directionality in a planealong the second processing surface 2. The direction of introduction ofthe second fluid is in the direction in which a component on theprocessing surface is made apart in the radial direction and in thedirection in which the component is forwarded in the rotation directionof the fluid between the rotating processing surfaces. In other words, apredetermined angle (θ2) exists facing the rotation direction R from areference line g in the outward direction and in the radial directionpassing through the opening d20.

The elevation angle (θ1) is arranged at more than 0° and less than 90°,and when the reaction speed is high, the angle (θ1) is preferablyarranged at 1° to 45°.

The angle (θ2) is also arranged at more than 0° and less than 90° atwhich the fluid is discharged from the opening d20 in the shaded regionin FIG. 27(B). When the reaction speed is high, the angle (η2) may besmall, and when the reaction speed is low, the angle (η2) is preferablyarranged larger. This angle can vary depending on various conditionssuch as the type of fluid, the reaction speed, viscosity, and therotation speed of the processing surface.

The bore diameter of the opening d20 is preferably 0.2 Rat to 3000 μm,more preferably 10 μm to 1000 μm. Even if the bore diameter of theopening d20 is relatively large, the diameter of the second introductionpart d2 shall be 0.2 μm to 3000 μm, more preferably 10 μm to 1000 μm,and when the diameter of the opening d20 does not substantiallyinfluence the flow of a fluid, the diameter of the second introductionpart d2 may be established in this range. Depending on whether the fluidis intended to be transferred straight or dispersed, the shape of theopening d20 is preferably changed and can be changed depending onvarious conditions such as the type of fluid, reaction speed, viscosity,and rotation speed of the processing surface.

The opening d20 in the separate flow path may be arranged at a positionnearer to the outer diameter than a position where the direction of flowupon introduction by the micro-pump effect from the depression arrangedin the first processing surface 1 is converted into the direction offlow of a spiral laminar flow formed between the processing surfaces.That is, in FIG. 26(B), the distance n from the outermost side in theradial direction of the processing surface of the depression arranged inthe first processing surface 1 to the outside in the radial direction ispreferably 0.5 mm or more. When a plurality of openings are arranged forthe same fluid, the openings are arranged preferably concentrically.When a plurality of openings are arranged for different fluids, theopenings are arranged preferably concentrically in positions differentin radius. This is effective for the reactions such as cases (1) A+B→Cand (2) C+D→E should occur in due order, but other case, i.e., A+B+C→Fshould not occur, or for circumventing a problem that an intendedreaction does not occur due to insufficient contact among reactants.

The processing members are dipped in a fluid, and a fluid obtained byreaction between the processing surfaces can be directly introduced intoa liquid outside the processing members or into a gas other than air.

Further, ultrasonic energy can be applied to the material just afterbeing discharged from the space between the processing surfaces or fromthe processing surface.

Then, the case where temperature regulating mechanisms J1 and J2 arearranged in at least one of the first processing member 10 and thesecond processing member 20 for generating a temperature differencebetween the first processing surface 1 and the second processing surface2 is described.

The temperature regulating mechanism is not particularly limited. Acooling part is arranged in the processing members 10 and 20 whencooling is intended. Specifically, a piping for passing ice water andvarious cooling media or a cooling element such as a Peltier devicecapable of electric or chemical cooling is attached to the processingmembers 10 and 20.

When heating is intended, a heating part is arranged in the processingmembers 10 and 20. Specifically, steam as a temperature regulatingmedium, a piping for passing various hot media, and a heating elementsuch as an electric heater capable of electric or chemical heating isattached to the processing members 10 and 20.

An accepting part for a new temperature regulating medium capable ofdirectly contacting with the processing members may be arranged in thering-accepting part. The temperature of the processing surfaces can beregulated by heat conduction of the processing members. Alternatively, acooling or heating element may be embedded in the processing members 10and 20 and electrified, or a path for passing a cooling medium may beembedded, and a temperature regulating medium (cooling medium) is passedthrough the path, whereby the temperature of the processing surfaces canbe regulated from the inside. By way of example, the temperatureregulating mechanisms J1 and J2 which are pipes (jackets) arrangedinside the processing members 10 and 20 are shown in FIG. 25.

By utilizing the temperature regulating mechanisms J1 and J2, thetemperature of one of the processing surfaces is made higher than thatof the other, to generate a temperature difference between theprocessing surfaces. For example, the first processing member 10 isheated to 60° C. by any of the methods, and the second processing member20 is set at 15° C. by any of the methods. In this case, the temperatureof the fluid introduced between the processing surfaces is changed from60° C. to 15° C. in the direction from the first processing surface 1 tothe second processing surface 2. That is, the fluid between theprocessing surfaces has a temperature gradient. The fluid between theprocessing surfaces initiates convection due to the temperaturegradient, and a flow in a direction perpendicular to the processingsurface is generated. The “flow in a direction perpendicular to theprocessing surface” refers to a flow in which components flowing in adirection perpendicular to at least the processing surface are containedin flowing components.

Even when the first processing surface 1 or the second processingsurface 2 rotates, the flow in a direction perpendicular to theprocessing surface is continued, and thus the flow in a directionperpendicular to the processing surface can be added to a spiral laminarflow between the processing surfaces caused by rotation of theprocessing surfaces. The temperature difference between the processingsurfaces is 1° C. to 400° C., preferably 5° C. to 100° C.

The rotary shaft 50 in this apparatus is not limited to a verticallyarranged shaft. For example, the rotary shaft may be arranged at aslant. This is because the influence of gravity can be substantiallyeliminated by a thin fluid film formed between the processing surfaces 1and 2 during processing. As shown in FIG. 25, the first introductionpart d1 coincides with the shaft center of the second ring 20 in thesecond holder 21 and extends vertically. However, the first introductionpart d1 is not limited to the one coinciding with the shaft center ofthe second ring 20, and as far as it can supply the first fluid to thespace surrounded with the rings 10 and 20, the part d1 may be arrangedat a position outside the shaft center in the central part 22 of thesecond holder 21 and may extend obliquely as well as vertically.Regardless of the angle at which the part d1 is arranged, a flowperpendicular to the processing surface can be generated by thetemperature gradient between the processing surfaces.

When the temperature gradient of the fluid between the processingsurfaces is low, heat conduction merely occurs in the fluid, but whenthe temperature gradient exceeds a certain border value, a phenomenoncalled Benard convection is generated in the fluid. This phenomenon isgoverned by Rayleigh number Ra, a dimensionless number, defined by thefollowing equation:Ra=L ³ ·g·β·ΔT/(α·ν)wherein L is the distance between processing surfaces; g isgravitational acceleration; β is coefficient of volumetric thermalexpansion of fluid; ν is dynamic viscosity of fluid; α is heatdiffusivity of fluid; and ΔT is temperature difference betweenprocessing surfaces. The critical Rayleigh number at which Benardconvection is initiated to occur, although varying depending on theproperties of a boundary phase between the processing surface and thefluid, is regarded as about 1700. At a value higher than this value,Benard convection occurs. Under the condition where the Rayleigh numberRa is a large value of about 10¹⁰ or more, the fluid becomes a turbulentflow. That is, the temperature difference ΔT between the processingsurfaces or the distance L between the processing surfaces in thisapparatus are regulated such that the Rayleigh number Ra becomes 1700 ormore, whereby a flow perpendicular to the processing surface can begenerated between the processing surfaces, and the reaction proceduresdescribed above can be carried out.

However, the Benard convection hardly occurs when the distance betweenthe processing surfaces is about 1 μm to 10 μm. Strictly, when theRayleigh number is applied to a fluid between the processing surfaceshaving a distance of 10 μm or less therebetween to examine theconditions under which Benard convection is generated, the temperaturedifference should be several thousands of degrees or more in the case ofwater, which is practically difficult. Benard convection is one relatedto density difference in temperature gradient of a fluid, that is, togravity. When the distance between the processing surfaces is 10 μm orless, there is high possibility of minute gravity field, and in such aplace, buoyancy convection is suppressed. That is, it is the case wherethe distance between the processing surfaces is 10 μm or more thatBenard convection actually occurs.

When the distance between the processing surfaces is about 1 μm to 10μm, convection is generated not due to density difference but due tosurface tension difference of a fluid resulting from temperaturegradient. Such convection is Marangoni convection. This phenomenon isgoverned by Marangoni number Ma, a dimensionless number, defined by thefollowing equation:Ma=σΔT·L/(ρ·ν·α)wherein L is the distance between processing surfaces; ν is dynamicviscosity of fluid; α is heat diffusivity of fluid; ΔT is temperaturedifference between processing surfaces; ρ is density of fluid; and σ istemperature coefficient of surface tension (temperature gradient ofsurface tension). The critical Marangoni number at which Marangoniconvection is initiated to occur is about 80, and under the conditionswhere the Marangoni number is higher than this value, Marangoniconvection occurs. That is, the temperature difference ΔT between theprocessing surfaces or the distance L between the processing surfaces inthis apparatus is regulated such that the Marangoni number Ma becomes 80or more, whereby a flow perpendicular to the processing surface can begenerated between the processing surfaces even if the distancetherebetween is as small as 10 μm or less, and the reaction proceduresdescribed above can be carried out.

For calculation of Rayleigh number, the following equations were used.

$\begin{matrix}{{{Ra} = {\frac{L^{3} \cdot \beta \cdot g}{v \cdot \alpha}\Delta\; T}}{{\Delta\; T} = \left( {T_{1} - T_{0}} \right)}{\alpha = \frac{k}{\rho \cdot C_{p}}}} & \left\lbrack {{Equation}\mspace{14mu} 1} \right\rbrack\end{matrix}$L is the distance (m) between processing surfaces; β is coefficient ofvolumetric thermal expansion (1/K); g is gravitational acceleration(m/s²); ν is dynamic viscosity (m²/s); α is heat diffusivity (m²/s); ΔTis temperature difference (K) between processing surfaces; pis density(kg/m³); Cp is isobaric specific heat (J/kg·K); k is heat conductivity(W/m·K); T₁ is temperature (K) at high temperature side in processingsurface; and T₀ is temperature (K) at low temperature side in processingsurface.

When the Rayleigh number at which Benard convection is initiated tooccur is the critical Rayleigh number Ra_(C), the temperature differenceΔT_(C1) is determined as follows:

$\begin{matrix}{{\Delta\; T_{C\; 1}} = \frac{{Ra}_{C} \cdot v \cdot \alpha}{L^{3} \cdot \beta \cdot g}} & \left\lbrack {{Equation}\mspace{14mu} 2} \right\rbrack\end{matrix}$

For calculation of Marangoni number, the following equations were used.

$\begin{matrix}{{{Ma} = {\frac{\sigma_{t} \cdot L}{\rho \cdot v \cdot \alpha}\Delta\; T}}{{\Delta\; T} = \left( {T_{1} - T_{0}} \right)}{\alpha = \frac{k}{\rho \cdot C_{p}}}} & \left\lbrack {{Equation}\mspace{14mu} 3} \right\rbrack\end{matrix}$L is the distance (m) between processing surfaces; ν is dynamicviscosity (m²/s); α is heat diffusivity (m²/s); ΔT is temperaturedifference (K) between processing surfaces; ρ is density (kg/m³); Cp isisobaric specific heat (J/kg·K); k is heat conductivity (W/m·K); σ_(t)is surface tension temperature coefficient (N/m·k); T₁ is temperature(K) of a high-temperature surface out of processing surface; and T₀ istemperature (K) of a low-temperature surface out of processing surface.

When the Marangoni number at which Marangoni convection is initiated tooccur is the critical Marangoni number Ma_(C), the temperaturedifference ΔT_(C2) is determined as follows:

$\begin{matrix}{{\Delta\; T_{C\; 2}} = \frac{{Ma}_{C} \cdot \rho \cdot v \cdot \alpha}{\sigma_{t} \cdot L}} & \left\lbrack {{Equation}\mspace{14mu} 4} \right\rbrack\end{matrix}$

The materials for the processing surface arranged to be opposite to eachother so as to be able to approach to and separate from each other, atleast one of which rotates relative to the other, are not particularlylimited, and the processing surfaces 1 and 2 can be prepared fromceramics, sintered metals, abrasion-resistant steels, other metalssubjected to hardening treatment, or rigid materials subjected tolining, coating or plating. In the present invention, the distancebetween the processing surfaces 1 and 2 arranged to be opposite to eachother so as to be able to approach to and separate from each other, atleast one of which rotates relative to the other, is 0.1 μm to 100 μm,particularly preferably 1 μm to 10 μm.

Hereinafter, production of resin microparticles according to the presentinvention is described.

Resin microparticles are formed by forced uniform mixing between theprocessing surfaces 1 and 2 arranged to be opposite to each other so asto be able to approach to and separate from each other, at least one ofwhich rotates relative to the other, in the apparatus shown in FIG.1(A).

First, a fluid containing at least one kind of aqueous solvent isintroduced as a first fluid through one flow path, that is, the firstintroduction part d1 into the space between the processing surfaces 1and 2 arranged to be opposite to each other so as to be able to approachto and separate from each other, at least one of which rotates relativeto the other, thereby forming a thin film fluid out of the first fluidbetween the processing surfaces.

Then, a fluid wherein at least one kind of resin is dissolved,preferably dispersed in a molecular state, in a solvent solubilizing,and compatible with, the resin is introduced as a second fluid directlythrough another flow path, that is, the second introduction part d2 intothe thin film fluid out of the first fluid produced between theprocessing surfaces 1 and 2.

As described above, a thin film fluid is formed between the processingsurfaces 1 and 2, the distance of which is regulated by the pressurebalance between the supply pressure of the fluid and the pressureexerted between the rotating processing surfaces. Then, the first fluidand the second fluid are allowed to flow together in this thin filmfluid to form a thin film fluid. The first fluid and the second fluidare allowed to flow together and mixed to form resin microparticles byseparation or emulsification. Usually, a surfactant is added to thefirst or second fluid to give a resin microparticle liquid dispersionhaving resin microparticles dispersed in a water phase. The processingin the present invention may or may not be accompanied by resin phasetransition.

The “emulsification” includes a step of preparing resin emulsionparticles by joining the first and second fluids together in a thin filmfluid between the processing surfaces and then emulsifying a resindissolved (dispersed in a molecular state) in the thin film fluid. Whenthe prepared resin emulsion particles are resin microparticlesthemselves, or when the resin emulsion particles are removed by removingthe solvent from the fluid containing the resin emulsion particles,water dispersion of the resin microparticles, and resin microparticles,can also be obtained from the resin emulsion particles.

To effect the preparation of the resin microparticles between theprocessing surfaces 1 and 2, the second fluid may be introduced throughthe first introduction part d1 and the first fluid through the secondintroduction part d2, as opposed to the above description. That is, theexpression “first” or “second” for each fluid has a meaning for merelydiscriminating an n^(th) fluid among a plurality of fluids present, andthird or more fluids can also be present.

The particle size, or monodispersity of the obtained resinmicroparticles can be regulated by changing the number of revolutions ofthe processing surfaces 1 and 2, the distance between the processingsurfaces 1 and 2 and the flow rate and temperature of the thin filmfluid, and the concentration of materials. As described above,monodisperse resin microparticles having a smaller volume-averageparticle size that those obtained by the previous reaction methods canbe obtained. Further, resin microparticles can be continuously andefficiently obtained with high production efficiency to cope withlarge-scale production. Depending on a necessary amount of production,the processing apparatus of the present invention can grow in size byusing general scale-up concept. The resin microparticles can be obtaineduniformly with low energy.

The solvent in which the resin is dissolved and dispersed in a molecularstate is not particularly limited as long as it shows solubility andcompatibility for the resin. As specific solvent, toluene, ethylacetate, butyl acetate, methyl ethyl ketone, and methyl isobutyl ketonecan be used singly or as a mixture of two or more thereof.

The aqueous solvent used in the present invention may be water alone ora mixture of water and a miscible solvent. The miscible solvent includesalcohols (methanol, isopropanol, ethylene glycol, and the like).

In place of the fluid in which a resin is dissolved or dispersed in amolecular state in the solvent with which the resin is soluble andcompatible, a fluid containing at least one kind of molten resin may beused. That is, the molten resin can be emulsified and dispersed in athin film fluid and then solidified. The fact that a resin is moltenmeans that, for example, a crystalline resin when heated to atemperature higher than the melting point shows properties as liquidfluid. When a resin such as an amorphous resin is molten, the resin uponheating to a temperature which is generally higher than the glasstransition point begins to decrease the viscosity thus showing behavioras fluid. On this occasion, the resin may be molten by itself or in asolvent with which the resin is not soluble or compatible. Thesolidification of the resin has an opposite meaning to melting. Themolten resin can thereby be heated and molten just beforeemulsification/dispersion treatment and then cooled after the treatment,so that the treatment can be effected in a short time, the heat history(=the sum total of (temperature×time)) on resin can be substantiallydecreased, and thus the risk of resin hydrolysis can be reduced.Accordingly, the temperature of the emulsification/dispersion treatmentcan be made higher than in conventional production methods. Therefore,the resin viscosity can be further reduced in emulsion/dispersiontreatment, and as a result, the objective particle size distribution canbe obtained with low energy. When the molten resin is separated oremulsified/dispersed at high temperatures, the quantity possessed is sosmall that the apparatus can be reduced in size, is easily handled andis highly safe.

The step of preliminarily mixing the resin in an aqueous solvent, whichhas been essential for gradually pulverizing resin particles in theexisting techniques, can be omitted according to the method forproducing the resin microparticle liquid dispersion of the presentinvention. That is, before the fluid is introduced between theprocessing surfaces 1 and 2, the present invention does not need thepreliminarily mixing step of previously mixing the resin in an aqueoussolvent such that the resin is dispersed in the state of coarseparticles in the aqueous solvent, and each fluid can be introduced assuch into the apparatus. Accordingly, there are advantages that theprocess can be simplified, the reduction in yield due to a complexprocess can be prevented, the heat history of resin generated duringpreliminary mixing can be omitted, and the risk of resin hydrolysis canbe reduced. Prior to introduction of the fluid into the space betweenthe processing surfaces 1 and 2, mixing of the resin in a part of theaqueous solvent in the first or second fluid does not correspond to“preliminary mixing”. This is because this treatment is a treatment forsupplying the resin with behavior as fluid and does not correspond totreatment for gradually pulverizing resin particles as in the prior art.

However, the production method of the present invention does notcompletely exclude the preliminarily mixing step. Accordingly, the samepreliminarily mixing step as conventional may be arranged.

The processing surfaces can be cooled or heated thereby obtainingdesired resin microparticles. Particularly, when a difference intemperature is set between the first processing surface 1 and the secondprocessing surface 2, there is an advantage that since convection can begenerated in a thin film fluid, the forced uniform mixing between theprocessing surfaces 1 and 2 can further be promoted.

In addition, the space between the processing surfaces may be irradiatedwith ultraviolet ray (UV), depending on the object.

The separation or emulsification/dispersion processing is conducted in acontainer capable of securing a depressurized or vacuum state, and asecondary side at which the fluid (resin microparticle liquiddispersion) after processing is discharged is depressurized or madevacuous, thereby being able to remove a gas generated when the fluidsjoin together in the thin film fluid and a gas contained in the fluid,or to remove the solvent of the fluid. By doing so, the resinmicroparticle-containing fluid between the processing surfaces isdischarged in an atomized state from the processing surfaces, even whenprocessing of removal of the solvent is conducted simultaneously withthe separation or emulsification/dispersion processing, so that thesurface area of the fluid is increased, and the efficiency of removal ofthe solvent is extremely high. Accordingly, separation oremulsification/dispersion processing and removal of the solvent can beeffected in substantially one step more easily than conventional.

The separation or emulsification/dispersion processing can be conductedin a container capable of temperature regulation to cool e.g. the fluid(resin microparticle liquid dispersion) just after being discharged,thereby solidifying the molten resin. By doing so, the resinmicroparticles obtained by the separation or emulsification/dispersionprocessing can be rapidly cooled to a stable temperature range for themicroparticles, that is, to a temperature lower than the melting pointor lower than the glass transition point. Alternatively, the containermay be heated to improve the efficiency of solvent removal and gasremoval.

As the resin, any resins can be used. Examples of such resins includevinyl polymerizing thermoplastic resins (styrene resin, olefin resin,acrylic resin, halogen-containing resin, vinyl ester resin orderivatives thereof), condensed thermoplastic resins (polyester resin,polyamide resin, polyurethane resin, poly(thio)ether resin,polycarbonate resin, polysulfone resin, polyimide resin, and the like),natural product-derived resins (cellulose ester resin and the like), andepoxy resin. These resins may be singly or as a mixture of two or morethereof. The resin may be crystalline or amorphous.

The styrene resin includes homopolymers or copolymers (polystyrene,styrene-vinyl toluene copolymer, styrene-α-methyl styrene copolymer, andthe like) of styrene monomers (styrene, α-methylstyrene, vinyltoluene,and the like), styrene monomer/copolymerizable monomer copolymers(styrene-acrylonitrile copolymer (AS resin),(meth)acrylate-ester-styrene copolymer (MS resin and the like),styrene-maleic anhydride copolymer, block copolymers such asstyrene-butadiene block copolymer, graft polymers (impact-resistantpolystyrene (HIPS, or rubber graft polystyrene resin)) produced by graftpolymerization of at least styrene monomers in the presence of a rubbercomponent, acrylonitrile-butadiene-styrene copolymer (ABS resin), graftcopolymers (AXS resins such as AES resin, AAS resin and ACS resin)wherein rubber components such as ethylene propylene rubber E, acrylrubber A, chlorinated polyethylene C, and vinyl acetate polymer are usedin place of butadiene rubber B of the ABS resin, and graft copolymers(methyl methacrylate-butadiene rubber-styrene copolymer (MBS resin) andthe like) wherein (meth)acrylate monomers (methyl methacrylate and thelike) are used in place of acrylonitrile of the ABS resin.

The olefin resin includes homopolymers or copolymers of α-C2-6 olefins,for example homopolymers or copolymers of olefins, such as polyethylene,polypropylene, ethylene-propylene copolymer, and poly(methylpentene-1),and copolymers of olefin and copolymerizable monomers (ethylene-vinylacetate copolymer, ethylene-(meth)acrylic acid copolymer,ethylene-(meth)acrylate-ester copolymer, and the like).

The acrylic resin includes homopolymers or copolymers of (meth)acrylicmonomers ((meth)acrylic acid, C1-C18 alkyl (meth)acrylate ester,hydroxyalkyl (meth)acrylate, glycidyl (meth)acrylate,(meth)acrylonitrile, and the like): for example, poly(meth)acrylateesters, e.g. methyl poly(meth)acrylate, methylmethacrylate-(meth)acrylic acid copolymers, methyl methacrylate-acrylateester-(meth)acrylic acid copolymer, methyl methacrylate-(meth)acrylateester copolymer, and (meth)acrylate ester-styrene copolymer (MS resinand the like).

The halogen-containing resin includes, for example, polyvinyl chlorideresin, vinyl chloride-vinyl acetate copolymer, vinylidene chlorideresin, and fluorine resin. The vinyl ester resin or its water-insolublederivatives include, for example, homopolymers or copolymers ofcarboxylic acid vinyl ester (polyvinyl acetate, ethylene-vinyl acetatecopolymer, and the like), their saponification products (vinyl alcoholresins such as polyvinyl alcohol with a saponification degree of 50% orless and ethylene-vinyl alcohol copolymer), and derivatives (forexample, polyvinyl acetal resins such as polyvinyl formal and polyvinylbutyral) from saponification products (vinyl alcohol resins).

The polyester resin includes various resins using a dicarboxylic acidcomponent, a diol component, oxycarboxylic acid, and lactones: forexample, poly C2-6 alkylene-arylate resins such as polyethyleneterephthalate, poly(trimethylene terephthalate), polypropyleneterephthalate, polybutylene terephthalate, poly(1,4-cyclohexyldimethylene terephthalate), polyethylene naphthalate and polybutylenenaphthalate; copolyesters containing C2-6 alkylene-arylate units asmajor (for example, 50% by weight or more) component (e.g. copolyesterswhose copolymerizable components are polyoxy C2-4 alkylene diols havingan oxyalkylene unit, or asymmetric aromatic dicarboxylic acids such asC6-12 aliphatic dicarboxylic acids, isophthalic acid, phthalic acid andthe like); polyarylate resins; aromatic polyester resins such as liquidcrystalline polyesters; poly(C2-6 alkylene glycol-C2-10 aliphaticdicarboxylic acid ester) such as poly C2-6 alkylene-oxalate, poly C2-6alkylene-succinate and poly C2-6 alkylene-adipate; polyoxycarboxylicacid resins (for example, polyglycolic acid, polylactic acid andglycolic acid-lactic acid copolymer); polylactone resins (for example,poly C3-12 lactone resins such as polycaprolactone); and copolyestersthereof (for example, polycaprolactone-polybutylene succinate copolymerresin). The polyester resins may contain urethane linkages. Further, thepolyester resins may have biodegradability.

The polyamide resins include, for example, aliphatic polyamide resins(e.g. polyamide 46, polyamide 6, polyamide 66, polyamide 11, polyamide12, polyamide 610, polyamide 612, polyamide 1010, polyamide 1012, andpolyamide 1212), copolyamides (e.g. polyamide 6/11, polyamide 6/12,polyamide 66/11, and polyamide 66/12), alicyclic polyamide resins, andaromatic polyamide resins. A dicarboxylic acid component in thepolyamide resins may contain a dimer acid unit. The polyamide resins mayhave biodegradability.

The polyurethane resins include, for example, diisocyanates (aliphaticdiisocyanates such as hexamethylene diisocyanate; alicyclicdiisocyanates such as 1,4-cyclohexane diisocyanate and isophoronediisocyanate; aromatic diisocyanates such as tolylene diisocyanate,diphenyl methane-4,4′-diisocyanate and 1,5-naphthalene diisocyanate orhydrogenerated diisocyanates thereof; and aromatic aliphaticdiisocyanates such as xylylene diisocyanate or hydrogenerateddiisocyanates thereof), polyols (for example, polyester polyols,polyether polyols such as polytetramethylene ether glycol, andpolycarbonate polyols), and polyurethane resins obtained by reactingwith a chain elongation agent, if necessary.

The poly(thio)ether resins include, for example, polyoxyalkylene resins(stabilized polyoxymethylene glycol or homo- or co-polyacetal resins,and polyoxy C1-4 alkylene diols such as polyoxypropylene glycol andpolyoxy tetramethylene glycol), polyphenylene ether resins,polyphenylene ether ketone resins, polysulfide resins (polythioetherresins such as polyphenylene sulfide or copolymers thereof), polyetherketone resins (including polyether ether ketone resins), and the like.

The polycarbonate resins include bisphenol-based aromatic polycarbonatessuch as bisphenol A-type polycarbonate resins, and aliphaticpolycarbonates such as diethylene glycol bisallyl carbonate.

The polysulfone resins can be exemplified by polysulfone resin,polyether sulfone resin, polyaryl sulfone resin, and the like. Thepolyimide resins can be exemplified by polyether imide resin, polyamideimide resin, polybenzimidazole resin, and the like.

The cellulose derivatives include cellulose esters (for example,cellulose acetates (acetate cellulose) such as cellulose diacetate andcellulose triacetate, acyl celluloses such as cellulose propionate,cellulose butyrate, cellulose acetate propionate and cellulose acetatebutyrate, inorganic acid esters of cellulose, and the like), andcellulose carbamates (cellulose phenyl carbamate, and the like). Ifnecessary, for example, alkyl celluloses such as ethyl cellulose,isopropyl cellulose and butyl cellulose, aralkyl celluloses such asbenzyl cellulose, and cyanoethyl cellulose may be used aswater-insoluble cellulose ethers.

The thermoplastic resins include thermoplastic elastomers (for example,polyamide elastomer, polyester elastomer, polyurethane elastomer,polystyrene elastomer, polyolefin elastomer, polyvinyl chlorideelastomer and fluorine thermoplastic elastomer), thermoplastic siliconeresins, and natural resins or derivatives thereof.

The epoxy resins include a ring opening polymerization product ofpolyepoxide (19), a polyaddition product between polyepoxide (19) and anactive hydrogen group-containing compound (D) {water, polyol [the diol(11) and trivalent or more polyol (12)], dicarboxylic acid (13),trivalent or more polycarboxylic acid (14), polyamine (16), polythiol(17) and the like}, and a cured product between polyepoxide (19) and anacid anhydride of dicarboxylic acid (13) or trivalent or morepolycarboxylic acid (14).

Preferable among these resins are, for example, styrene resins, olefinresins, acrylic resins, halogen-containing resins, vinyl ester resins orderivatives thereof (polyvinyl acetal resin and the like), polyesterresins, polyamide resins, polyurethane resins, poly(thio)ether resins,polycarbonate resins, polysulfone resins, polyimide resins, celluloseester resins (acetate cellulose resin and the like), and epoxy resins.Also, preferable are biodegradable resins like biodegradable polyesterresins such as aliphatic polyester resins (for example, polylactic acidresins and poly C3-12 lactone resins) and polyester amide, vinyl alcoholresins, and aforementioned cellulose derivatives.

These resins may be colorant-containing kneaded resins.

As the colorant, every dye and pigment known in the art can be used.Examples of the colorant that can be used include carbon black,nigrosine dye, iron black, naphthol yellow S, hansa yellow (10G, 5G, G),cadmium yellow, yellow iron oxide, yellow ocher, chrome yellow, titaniumyellow, polyazo yellow, oil yellow, hansa yellow (GR, A, RN, R), pigmentyellow L, benzidine yellow (G, GR), permanent yellow (NCG), Vulcan FastYellow (5G, R), tartrazine lake, quinone yellow lake, Anthrazane YellowBGL, isoindolinone yellow, bengara, colcothar, red lead, cadmium red,cadmium mercury red, antimony red, permanent red 4R, Para Red, FiseyRed, para chloro ortho nitro aniline red, Lithol Fast Scarlet G,Brilliant Fast Scarlet, Brilliant Carmine BS, Permanent Red (F2R, F4R,FRL, FRLL, F4RH), Fast Scarlet VD, Vulcan Fast Rubine B, BrilliantScarlet G, Lithol Rubine GX, Permanent Red F5R, Brilliant Carmine 6B,Pigment Scarlet 3B, Bordeaux 5B, toluidine maroon, Permanent BordeauxF2K, Helio Bordeaux BL, Bordeaux 10B, Bon Maroon Light, Bon MaroonMedium, eosin lake, rhodamine lake B, rhodamine lake Y, alizarin lake,thio indigo red B, thio indigo maroon, oil red, quinacridone red,pyrazolone red, polyazo red, chrome vermilion, benzidine orange,perinone orange, oil orange, cobalt blue, cerulean blue, alkali bluelake, peacock blue lake, Victoria blue lake, metal-free phthalocyanineblue, phthalocyanine blue, Fast Sky Blue, indanthrene blue (RS, BC),indigo, ultramarine blue, Prussian blue, anthraquinone blue, Fast VioletB, methyl violet lake, cobalt violet, manganese violet, dioxane violet,anthraquinone violet, chrome green, zinc green, chrome oxide, viridian,emerald green, pigment green B, naphthol green B, green gold, acid greenlake, malachite green lake, phthalocyanine green, anthraquinone green,titanium oxide, zinc white, lithopone, and mixtures thereof.

At least one of the fluids may contain a dispersant. The dispersant isnot particularly limited. The dispersant in an aqueous solvent includeswater-soluble resins such as polyvinyl alcohol, polyethylene glycol,polyethylene oxide, polyvinyl pyrrolidone, water-soluble acrylic resin,water-soluble styrene resin and cellulose ether resin, and water-solublesaccharide compositions that contain oligosaccharide. In other solvents,known surfactants can be used and a dispersion stabilizer selected froma cationic surfactant, an anionic surfactant, a nonionic surfactant, andthe like can be used. These surfactants may be used as a mixture of twoor more thereof.

Specific examples of the cationic surfactant include dodecyl ammoniumchloride, dodecyl ammonium bromide, dodecyl trimethyl ammonium bromide,dodecyl pyridinium chloride, dodecyl pyridinium bromide, hexadecyltrimethyl ammonium bromide, and the like.

Specific examples of the anionic surfactant include sulfonates (sodiumdodecylbenzene sulfonate, sodium arylalkyl polyether sulfonate,3,3-disulfone diphenyl urea-4,4-diazo-bis-amino-8-naphthol-6-sodiumsulfonate, ortho-carboxybenzene-azo-dimethylaniline,2,2,5,5-tetramethyl-triphenylmethane-4,4-diazo-bis-β-naphthol-6-sodiumsulfonate, and the like), sulfate esters (sodium dodecyl sulfate, sodiumtetradecyl sulfate, sodium pentadecyl sulfate, sodium octyl sulfate, andthe like) and fatty acid salts (sodiumoleate, sodiumlaurate,sodiumcaprate, sodiumcaprylate, sodium caproate, potassium stearate,calcium oleate, and the like).

The nonionic surfactants include polyethylene oxide, polypropyleneoxide, a combination of polypropylene oxide and polyethylene oxide, anester between polyethylene glycol and higher fatty acid, alkyl phenolpolyethylene oxide, an ester between higher fatty acid and polyethyleneglycol, an ester between higher fatty acid and polypropylene oxide,sorbitan ester, and the like.

When a water dispersion of polyester resin into which carboxyl groupswere introduced is prepared, a part or the whole of polar groups such ascarboxyl groups on the surface of the dispersion may be contained in thefluid to stabilize the fluid by neutralization with the dispersion.

The basic substance that can be used in the neutralization includes, forexample, amine compounds represented by ammonia and triethylamine andinorganic bases represented by sodium hydroxide, potassium hydroxide andlithium hydroxide.

Specific examples of the amine compounds include ammonia,monomethylamine, dimethylamine, trimethylamine, monoethylamine,diethylamine, triethylamine, mono-n-propylamine, dimethyl-n-propylamine,monoethanolamine, diethanolamine, triethanolamine, N-methanolamine,N-aminoethylethanolamine, N-methyldiethanolamine, monoisopropanolamine,diisopropanolamine, triisopropanolamine, N,N-dimethylethanolamine, andN,N-dimethylpropanolamine. Preferable among them are triethylamine,monoethanolamine, diethanolamine, triethanolamine,N,N-dimethylethanolamine, and N,N-dimethylpropanolamine. These aminecompounds may be used as a mixture of two or more thereof.

When the resulting resin is used in an electrophotographic toner, afluid containing at least one member selected from the above-mentionedcolorant, an electrification regulator, a release agent, an externaladditive, a magnetic carrier, and electrically conductive powders may beused in the fluid in the method for producing the resin microparticles.

As the release agent, wax is preferably used. The wax may be known one.Examples of the wax include carbonyl group-containing wax, for example,polyolefin wax (polyethylene wax, polypropylene wax, and the like),long-chain hydrocarbons (paraffin wax, Sasol wax, and the like),polyalkanoic acid esters (carnauba wax, montan wax, trimethylol propanetribehenate, pentaerythritol tetrabehenate, pentaerythritol diacetatedibehenate, glycerin tribehenate, 1,18-octadecanediol distearate, andthe like), polyalkanol esters (tristearyl trimellitate, distearylmaleate, and the like), polyalkanoic acid amides (ethylenediaminedibehenyl amide and the like), polyalkyl amides (tristearyl trimellitateamide and the like), and dialkyl ketones (distearyl ketone and thelike).

The electrification regulator used may be known one. Examples of theelectrification regulator include nigrosine dyes, triphenylmethane dyes,chrome-containing metal complex dyes, molybdate chelate pigments,rhodamine dyes, alkoxy amines, quaternary ammonium salts (includingfluorine-modified quaternary ammonium salts), alkyl amides, phosphoruselement or compound, tungsten element or compound, fluorine activators,metal salicylate and metal salts of salicylic acid derivatives.

Specific examples include nigrosine dye Bontron 03, quaternary ammoniumsalt Bontron P-51, metal-containing azo dye Bontron S-34, oxynaphthoatemetal complex E-82, salicylate metal complex E-84 and phenol condensateE-89 (manufactured by Orient Chemical Industries Co., Ltd.), quaternaryammonium salt molybdenum complexes TP-302 and TP-415 (manufactured byHodogaya Chemical Co., Ltd.), quaternary ammonium salt Copy Charge PSYVP2038, triphenylmethane derivative Copy Blue PR, quaternary ammoniumsalt Copy Charge NEG VP2036, Copy Charge NX VP434 (manufactured byHoechst AG), LRA-901, boron complex LR-147 (manufactured by Japan CarlitCo., Ltd.), copper phthalocyanine, perylene, quinacridone, azo pigment,and other polymer compounds having functional groups such as sulfonicacid group, carboxyl group and quaternary ammonium salt.

As the external additive, inorganic microparticles can be preferablyused. Specific examples of the inorganic microparticles include, forexample, silica, alumina, titanium oxide, barium titanate, magnesiumtitanate, calcium titanate, strontium titanate, zinc oxide, tin oxide,siliceous sand, clay, mica, tabular spar, diatomaceous earth, chromiumoxide, cerium oxide, colcothar, antimony trioxide, magnesium oxide,zirconium oxide, barium sulfate, barium carbonate, calcium carbonate,silicon carbide and silicon nitride.

Other polymer microparticles include, for example, those obtained bysoap-free emulsion polymerization, suspension polymerization anddispersion polymerization: for example, polystyrene, methacrylate estersand acrylate ester copolymers, polycondensation products such assilicone, benzoguanamine and nylon, and polymer particles ofthermosetting resin. Such fluidizers may be surface-treated to increasehydrophobicity and can prevent deterioration in flow characteristics andelectrification characteristics even under high humidity. Preferableexamples of surface treatment agents include silane coupling agents,silylating agents, silane coupling agents having an alkyl fluoridegroup, organic titanate coupling agents, aluminum coupling agents,silicone oil and modified silicone oil.

As for magnetic carriers, conventionally known ones such as iron powder,ferrite powder, magnetite powder and magnetic resin carriers can beused. And, as for the covering materials, included are amino resins: forexample, urea-formaldehyde resin, melamine resin, benzoguanamine resin,urea resin and polyamide resin.

The electrically conductive powder that can be used includes metalpowder, carbon black, titanium oxide, tin oxide and zinc oxide.

As the fluid in the method for producing the resin microparticles, afluid containing silver nanoparticles can be used. Silvermicroparticle-containing resin microparticles having silvernanoparticles dispersed uniformly in a resin structure can be preparedto confer an antibacterial effect on resin products.

In this manner, a dispersion (suspension) of resin microparticles havinga volume-average particle size of 1 nm to 10000 nm, preferably 10 nm to800 nm, more preferably 40 nm to 500 nm can be prepared.

As described above, the processing apparatus can be provided with athird introduction part d3 in addition to the first introduction part d1and the second introduction part d2. In this case, a resin solution, asurfactant solution, and a colorant for example can be introducedseparately through the respective introduction parts into the processingapparatus. By doing so, the concentration and pressure of each solutioncan be separately controlled, and the reaction of forming resinmicroparticles can be regulated more accurately. When the processingapparatus is provided with four or more introduction parts, theforegoing applies and fluids to be introduced into the processingapparatus can be subdivided in this manner.

EXAMPLE

Hereinafter, the present invention is described in detail with referenceto Examples, but the present invention is not limited to Examples.

A resin solution or resin liquid dispersion is allowed to flow into anaqueous solvent in a thin film fluid between the processing surfaces 1and 2 arranged to be opposite to each other so as to be able to approachto and separate from each other, at least one of which rotates relativeto the other, in use of a uniformly stirring and mixing reactionapparatus shown in FIG. 1(A), thereby uniformly mixing them in the thinfilm fluid.

In following Examples, the term “from the center” means “through thefirst introduction part d1” in the processing apparatus shown in FIG.1(A), the first fluid refers to the first processed fluid, and thesecond fluid refers to the second processed fluid introduced “throughthe second introduction part d2” in the processing apparatus shown inFIG. 1(A). The term “part” refers to “parts by weight”.

(Volume-Average Particle Size)

Particle size distribution was measured with a particle sizedistribution measuring instrument utilizing a laser Doppler method(trade name: Microtrac UPA150, manufactured by Nikkiso Co., Ltd.), andvolume-average particle size was used.

Example 1

A glass flask equipped with a stirrer, a distillation column, athermometer and a nitrogen inlet was charged with 8 moles of neopentylglycol, 4 moles of ethylene glycol and 8 moles of terephthalic acid. Theflask was heated in a nitrogen stream to 180° C. in a mantle heater, apolymerization initiator (titanium tetrabutoxide) in an amount of 0.14%based on the total amount of the acid and alcohol components charged wasadded, and the mixture was reacted by heating under stirring. Theprogress of the reaction was monitored by measuring the acid value, andwhen a predetermined acid value was reached, the reaction was finishedto give a polyester resin having a weight-average molecular weight of650, a Tg of 56° C., a Tm of 103° C. and an acid value of 3.2.

While an aqueous solvent (1% dodecyl sodium sulfate aqueous solution)was sent as a first fluid from the center at a supply pressure/backpressure of 0.20 MPa/0.01 MPa and at a revolution number of 500 rpm, 5%polyester resin ethyl acetate solution using the above polyester resinwas introduced at a rate of 10 ml/min. as a second fluid into the spacebetween the processing surfaces 1 and 2 such that the first and secondfluids were mixed and discharged at a rate of 30 ml/min. A polyesterresin microparticle dispersion having a volume-average particle size of45.2 nm was obtained.

Examples 2 to 4

In Examples 2 to 4, the same polyester resin ethyl acetate solution andaqueous solvent as in Example 1 were used, and the number ofrevolutions, supply pressure and the flow rate of the discharge werechanged, whereby polyester resin microparticle dispersions wereobtained.

Example 5

While an aqueous solvent (1% dodecyl sodium sulfate/0.5% polyvinylalcohol aqueous solution) was sent as a first fluid from the center at asupply pressure/back pressure of 0.60 MPa/0.45 MPa and at a revolutionnumber of 500 rpm, a softened polyester resin liquid dispersion preparedby mixing 210 g of polyester resin (weight average molecular weight16,000, softening temperature=105° C.) in 490 g of ion-exchange water(this “mixing” does not correspond to conventional “preliminary mixing”)and then heating the resulting polyester resin liquid dispersion to 150°C. just before introduction to soften the resin (30% softened polyesterresin liquid dispersion) was introduced as a second fluid at 10 ml/min.into the space between the processing surfaces 1 and 2. A polyesterresin microparticle dispersion having a volume-average particle size of63.1 nm was obtained.

Examples 6 to 8

In Examples 6 to 8, polyester resin microparticle dispersions wereobtained using the same softened polyester resin in ion-exchange water(softened polyester resin liquid dispersion) and the same aqueoussolvent as in Example 5 by changing the number of revolutions, thesupply pressure, and the flow rate of the discharge.

Example 9

While an aqueous solvent (0.7% sodium diisooctyl sulfosuccinate (tradename: AOT, Wako Pure Chemical Industries, Ltd.)/99.3% deionized water)was sent as a first fluid from the center at a supply pressure/backpressure of 0.15 MPa/0.01 MPa and at a revolution number of 1000 rpm,0.4% polystyrene (PS) (trade name: Polystyrene, manufactured bySigma-Aldrich Co.)/99.6% tetrahydrofuran (THF) (also called “PSsolution”) was introduced as a second fluid at 10 ml/min. into the spacebetween the processing surfaces 1 and 2, and the mixture was mixed andemulsified such that the amount of the discharge became 20 g/min., togive a polyester resin microparticle dispersion having a volume-averageparticle size of 58.3 nm.

Examples 10 to 12

In Examples 10 to 12, polyester resin microparticle dispersions wereobtained using the same PS solution and the same aqueous solvent as inExample 9 by changing the number of revolutions, the supply pressure,and the flow rate of the discharge.

Comparative Example

Using the same polyester resin ethyl acetate solution and the sameaqueous solvent as in Example 1, the polyester resin ethyl acetatesolution was suspended in the aqueous solvent with CLEARMIX(manufactured by M Technique Co., Ltd.) to prepare a polyester resinmicroparticle dispersion. At this time, the number of revolutions withCLEARMIX was 20000 rpm, and stirring was conducted for 30 minutes. Apolyester resin microparticle dispersion having a volume-averageparticle size of 105.4 nm was obtained.

The results are shown in Table 1.

TABLE 1 Number of Supply Discharge Volume-Average Primary RevolutionsPressure Amount Particle Size Example First Fluid Second Fluid [rpm][MPaG] [g/min] [nm] 1 1% dodecyl 5% polyester 500 0.2 30 45.2 2 sodiumsulfate resin ethyl 0.4 50 66.5 3 aqueous solution acetate solution 10000.4 50 32.1 4 2000 50 29.9 5 1% dodecyl sodium 30% softened 500 0.6 5063.1 6 sulfate/0.5 polyester 1000 44.8 7 polyvinyl alcohol resin liquid2000 53.1 8 aqueous solution dispersion 3000 74.1 9 0.7% AOT/ 0.4% 10000.15 20 58.3 10 deionized polystyrene/ 0.22 52 71.8 11 water 99.3%tetrahydrofuran 3000 0.4 50 28.3 12 solution solution 4000 50 46.2Comparative 1% dodecyl sodium 5% polyester resin 20000 — — 105.4 Example1 sulfate aqueous ethyl acetate solution solution

The amount of energy necessary for obtaining the resin microparticles inExamples was not higher than 1/10 relative to that in ComparativeExample, although the volume-average particle size was made smaller inExamples. From this result, it was found that the production method inExamples is superior in energy efficiency.

1. A method for producing a resin microparticle aqueous dispersion,comprising: imparting pressure to one fluid to be processed by a fluidpressure imparting mechanism, rotating at least two processing membersof a first processing member and a second processing member relative toeach other by a rotation drive mechanism, wherein at least twoprocessing surfaces of a first processing surface and a secondprocessing surface are disposed opposite to each other, and the firstprocessing member has the first processing surface and the secondprocessing member has the second processing surface, the secondprocessing member is structurally configured to relatively approach toand separate from the first processing member, and each of theprocessing surface constitutes part of a sealed flow path through whichthe one fluid is passed, providing at least the second processing memberwith a pressure-receiving surface, wherein at least part of thepressure-receiving surface is comprised of the second processingsurface, receiving, by the pressure-receiving surface, pressure appliedto the one fluid by the fluid pressure imparting mechanism, therebygenerating the force to move in the direction of separating the secondprocessing surface from the first processing surface, wherein the onefluid which receives pressure from the fluid pressure impartingmechanism is passed between the first and second processing surfacesbeing capable of approaching to and separating from each other androtating relative to each other, whereby the one fluid forms a thin filmfluid while passing between both the processing surfaces, includinganother independent path independent of the flow path through which theanother kind of fluid to be processed is passed, and introducing anotherkind of fluid to be processed into the space between the processingsurfaces through the another introduction path, wherein at least oneopening leading to the another introduction path is arranged in at leasteither the first processing surface or the second processing surface,thereby forming the thin film fluid, wherein at least two fluids areused as the aforementioned fluid to be processed, wherein at least onekind of the fluids is a fluid having at least one kind of resindissolved in a solvent with which a resin is soluble and compatible, andat least one kind of fluid other than said fluids to be processedincludes an aqueous solvent, and wherein either one of the fluid to beprocessed in which resin is dissolved and the fluid to be processedincluding the aqueous solvent is used as said one fluid to be processed,while the other one is used as said another kind of fluid to beprocessed, and the respective fluids to be processed join together andare mixed in the thin film fluid, whereby resin microparticles areobtained in the thin film fluid by way of separation.
 2. A method forproducing a resin microparticle aqueous dispersion, comprising:imparting pressure to one fluid to be processed by a fluid pressureimparting mechanism, rotating at least two processing members of a firstprocessing member and a second processing member relative to each otherby a rotation drive mechanism, wherein at least two processing surfacesof a first processing surface and a second processing surface aredisposed opposite to each other, and the first processing member has thefirst processing surface and the second processing member has the secondprocessing surface, the second processing member being structurallyconfigured to relatively approach to and separate from the firstprocessing member, and each of the processing surface constitutes partof a sealed flow path through which the one fluid is passed, providingat least the second processing member with a pressure-receiving surface,wherein at least part of the pressure-receiving surface is comprised ofthe second processing surface, receiving, by the pressure-receivingsurface, pressure applied to the one fluid by the fluid pressureimparting mechanism, thereby generating the force to move in thedirection of separating the second processing surface from the firstprocessing surface, wherein the one fluid which receives pressure fromthe fluid pressure imparting mechanism is passed between the first andsecond processing surfaces being capable of approaching to andseparating from each other and rotating relative to each other, wherebythe one fluid forms a thin film fluid while passing between both theprocessing surfaces, including another independent path independent ofthe flow path through which the another kind of fluid to be processed ispassed, and introducing another kind of fluid to be processed into thespace between the processing surfaces through the another introductionpath, wherein at least one opening leading to the another introductionpath is arranged in at least either the first processing surface or thesecond processing surface, thereby forming the thin film fluid, whereinat least two fluids are used as the aforementioned fluid to beprocessed, wherein at least one kind of the fluids is a fluid having atleast one kind of resin dissolved in a solvent with which a resin issoluble and compatible, and at least one kind of fluid other than saidfluids to be processed includes an aqueous solvent, and wherein eitherone of the fluid to be processed in which resin is dissolved and thefluid to be processed including the aqueous solvent is used as said onefluid to be processed, while the other one is used as said another kindof fluid to be processed, and the respective fluids to be processed jointogether and are mixed in the thin film fluid whereby resinmicroparticles are obtained in the thin film fluid by way ofemulsification.
 3. A method for producing a resin microparticle aqueousdispersion, comprising: imparting pressure to one fluid to be processedby a fluid pressure imparting mechanism, rotating at least twoprocessing members of a first processing member and a second processingmember relative to each other by a rotation drive mechanism, wherein atleast two processing surfaces of a first processing surface and a secondprocessing surface are disposed opposite to each other, and the firstprocessing member has the first processing surface and the secondprocessing member has the second processing surface, the secondprocessing member being structurally configured to relatively approachto and separate from the first processing member, and each of theprocessing surface constitutes part of a sealed flow path through whichthe one fluid is passed, providing at least the second processing memberwith a pressure-receiving surface, wherein at least part of thepressure-receiving surface is comprised of the second processingsurface, receiving, by the pressure-receiving surface, pressure appliedto the one fluid by the fluid pressure imparting mechanism, therebygenerating the force to move in the direction of separating the secondprocessing surface from the first processing surface, wherein the onefluid which receives pressure from the fluid pressure impartingmechanism is passed between the first and second processing surfacesbeing capable of approaching to and separating from each other androtating relative to each other, whereby the one fluid forms a thin filmfluid while passing between both the processing surfaces, includinganother independent path independent of the flow path through which theanother kind of fluid to be processed is passed, and introducing anotherkind of fluid to be processed into the space between the processingsurfaces through the another introduction path, wherein at least oneopening leading to the another introduction path is arranged in at leasteither the first processing surface or the second processing surface,thereby forming the thin film fluid, wherein at least two fluids areused as the aforementioned fluid to be processed, wherein at least onekind of the fluids is a fluid containing at least one kind of resin thatis heated and molten, and at least one kind of fluid other than saidfluids to be processed includes an aqueous solvent, and wherein eitherone of the fluid to be processed in which resin is dissolved and thefluid to be processed including the aqueous solvent is used as said onefluid to be processed, while the other one is used as said another kindof fluid to be processed, and the respective fluids to be processed jointogether in a thin film fluid formed between two processing surfacesarranged opposite to each other so as to be able to approach to andseparate from each other, at least one of which rotates relative to theother, whereby resin microparticles are obtained in the thin film fluidby way of emulsification/dispersion.
 4. The method for producing a resinmicroparticle aqueous dispersion according to claim 1, wherein the spacebetween the processing surfaces is cooled or heated.
 5. A method forproducing a resin microparticle aqueous dispersion, wherein at least twofluids are used as the aforementioned fluid to be processed, wherein atleast one kind of the fluids is a fluid having, at least one kind ofresin dissolved in a solvent with which a resin is soluble andcompatible, and at least one kind of fluid other than said fluids to beprocessed includes an aqueous solvent, and, the respective fluids to beprocessed join together in a thin film fluid formed between twoprocessing surfaces arranged opposite to each other so as to be able toapproach to and separate from each other, at least one of which rotatesrelative to the other, whereby resin microparticles are obtained in thethin film fluid by way of separation, wherein the separation isconducted in a container capable of securing a depressurized or vacuumstate, to form a depressurized or vacuum state of the secondary side atwhich the fluid to be processed after processing is discharged therebybeing capable of removing a solvent in the fluid or a gas generated byway of joining of each of the fluids to be processed in the thin filmfluid and a gas contained in the fluids to be processed.
 6. The methodfor producing a resin microparticle aqueous dispersion according toclaim 5, wherein the separation is conducted in a container capable ofadjusting a temperature, to heat the inside of the container therebyimproving efficiency of the treatments of removing the solvent and thegas.
 7. A method for producing a resin microparticle aqueous dispersion,wherein at least two fluids are used as the aforementioned fluid to beprocessed, wherein at least one kind of the fluids is a fluid having atleast one kind of resin dissolved in a solvent with which a resin issoluble and compatible, and at least one kind of fluid other than saidfluids to be processed includes an aqueous solvent, and, the respectivefluids to be processed join together in a thin film fluid formed betweentwo processing surfaces arranged opposite to each other so as to be ableto approach to and separate from each other, at least one of whichrotates relative to the other, whereby resin microparticles are obtainedin the thin film fluid by way of separation, wherein the separation isconducted in a container capable of adjusting a temperature, to cool theprocessed fluid immediately after the fluid is discharged.
 8. The methodfor producing a resin microparticle aqueous dispersion according toclaim 1, wherein the resin is at least one kind of resin selected fromstyrene resin, olefin resin, acrylic resin, halogen-containing resin,vinyl ester resin or derivatives thereof, polyester resin, polyamideresin, polyurethane resin, poly(thio)ether resin, polycarbonate resin,polysulfone resin, polyimide resin, cellulose ester derivativesincluding cellulose ester resin, and epoxy resine, aliphatic polyesterresins, biodegradable polyester resins, and vinyl alcohol resins.
 9. Themethod for producing a resin microparticle aqueous dispersion accordingto claim 1, wherein the resin contains a colorant.
 10. The method forproducing a resin microparticle aqueous dispersion according to claim 1,wherein at least one kind of the fluids to be processed contains adispersant selected from the group consisting of water-soluble resin ofpolyvinyl alcohol, polyethylene glycol, polyethylene oxide, polyvinylpyrrolidone, water-soluble acrylic resin, water-soluble styrene resinand cellulose ether resin, oligosaccharide, and surfactants.
 11. Themethod for producing a resin microparticle aqueous dispersion accordingto claim 1, wherein at least one kind of the fluids to be processedcontains a colorant, an electrification regulator, a release agent, anexternal additive, a magnetic carrier, and electrically conductivepowders.
 12. A method for producing a resin microparticle aqueousdispersion, wherein at least two fluids are used as the aforementionedfluid to be processed, wherein at least one kind of the fluids is afluid having at least one kind of resin dissolved in a solvent withwhich a resin is soluble and compatible, and at least one kind of fluidother than said fluids to be processed includes an aqueous solvent, and,the respective fluids to be processed join together in a thin film fluidformed between two processing surfaces arranged so as to be able toapproach to and separate from each other, at least one of which rotatesrelative to the other, whereby resin microparticles are obtained in thethin film fluid by way of separation, wherein at least one kind of thefluids to be processed contain silver nanoparticles.
 13. The method forproducing a resin microparticle aqueous dispersion according to claim 1,wherein the volume-average particle size of the obtained resinmicroparticles is 1 nm to 10000 nm.
 14. A method for producing a resinmicroparticle aqueous dispersion, wherein at least two fluids are usedas the aforementioned fluid to be processed, wherein at least one kindof the fluids is a fluid having at least one kind of resin dissolved ina solvent with which a resin is soluble and compatible, and at least onekind of fluid other than said fluids to be processed includes an aqueoussolvent, and, the respective fluids to be processed join together in athin film fluid formed between two processing surfaces arranged oppositeto each other so as to be able to approach to and separate from eachother, at least one of which rotates relative to the other, wherebyresin microparticles are obtained in the thin film fluid by way ofemulsification, wherein the emulsification is conducted in a containercapable of securing a depressurized or vacuum state, to form adepressurized or vacuum state of the secondary side at which the fluidto be processed after processing is discharged thereby being capable ofremoving a solvent in the fluid or a gas generated by way of joining ofeach of the fluids to be processed in the thin film fluid and a gascontained in the fluids to be processed.
 15. The method for producing aresin microparticle aqueous dispersion according to claim 14, whereinthe emulsification is conducted in a container capable of adjusting atemperature, to heat the inside of the container thereby improvingefficiency of the treatments of removing the solvent and the gas.
 16. Amethod for producing a resin microparticle aqueous dispersion, whereinat least two fluids are used as the aforementioned fluid to beprocessed, wherein at least one kind of the fluids is a fluid having atleast one kind of resin dissolved in a solvent with which a resin issoluble and compatible, and at least one kind of fluid other than saidfluids to be processed includes an aqueous solvent, and, the respectivefluids to be processed join together in a thin film fluid formed betweentwo processing surfaces arranged opposite to each other so as to be ableto approach to and separate from each other, at least one of whichrotates relative to the other, whereby resin microparticles are obtainedin the thin film fluid by way of emulsification, wherein theemulsification is conducted in a container capable of adjusting atemperature, to cool the processed fluid immediately after the fluid isdischarged.
 17. A method for producing a resin microparticle aqueousdispersion, wherein at least two fluids are used as the aforementionedfluid to be processed, wherein at least one kind of the fluids is afluid containing at least one kind of resin that is heated and molten,and at least one kind of fluid other than said fluids to be processedincludes an aqueous solvent, the respective fluids to be processed jointogether in a thin film fluid formed between two processing surfacesarranged opposite to each other so as to be able to approach to andseparate from each other, at least one of which rotates relative to theother, whereby resin microparticles are obtained in the thin film fluidby way of emulsification/dispersion, wherein theemulsification/dispersion is conducted in a container capable ofsecuring a depressurized or vacuum state, to form a depressurized orvacuum state of the secondary side at which the fluid to be processedafter processing is discharged thereby being capable of removing asolvent in the fluid or a gas generated by way of joining of each of thefluids to be processed in the thin film fluid and a gas contained in thefluids to be processed.
 18. The method for producing a resinmicroparticle aqueous dispersion according to claim 17, wherein theemulsification/dispersion is conducted in a container capable ofadjusting a temperature, to heat the inside of the container therebyimproving efficiency of the treatments of removing the solvent and thegas.
 19. A method for producing a resin microparticle aqueousdispersion, wherein at least two fluids are used as the aforementionedfluid to be processed, wherein at least one kind of the fluids is afluid containing at least one kind of resin that is heated and molten,and at least one kind of fluid other than said fluids to be processedincludes an aqueous solvent, the respective fluids to be processed jointogether in a thin film fluid formed between two processing surfacesarranged opposite to each other so as to be able to approach to andseparate from each other, at least one of which rotates relative to theother, whereby resin microparticles are obtained in the thin film fluidby way of emulsification/dispersion, wherein theemulsification/dispersion is conducted in a container capable ofadjusting a temperature, to cool the processed fluid immediately afterthe fluid is discharged.
 20. A method for producing a resinmicroparticle aqueous dispersion, wherein at least two fluids are usedas the aforementioned fluid to be processed, wherein at least one kindof the fluids is a fluid having at least one kind of resin dissolved ina solvent with which a resin is soluble and compatible, and at least onekind of fluid other than said fluids to be processed includes an aqueoussolvent, and, the respective fluids to be processed join together in athin film fluid formed between two processing surfaces arranged oppositeto each other so as to be able to approach to and separate from eachother, at least one of which rotates relative to the other, wherebyresin microparticles are obtained in the thin film fluid by way ofemulsification, wherein at least one kind of the fluids to be processedcontain silver nanoparticles.
 21. A method for producing a resinmicroparticle aqueous dispersion, wherein at least two fluids are usedas the aforementioned fluid to be processed, wherein at least one kindof the fluids is a fluid containing at least one kind of resin that isheated and molten, and at least one kind of fluid other than said fluidsto be processed includes an aqueous solvent, the respective fluids to beprocessed join together in a thin film fluid formed between twoprocessing surfaces arranged opposite to each other so as to be able toapproach to and separate from each other, at least one of which rotatesrelative to the other, whereby resin microparticles are obtained in thethin film fluid by way of emulsification/dispersion, wherein at leastone kind of the fluids to be processed contain silver nanoparticles. 22.The method for producing a resin microparticle aqueous dispersionaccording to claim 1, wherein the opening is positioned downstream at apoint where a direction of flow of the one fluid to be processed ischanged to a direction of flow of the spiral laminar flow formed betweenthe both of processing surfaces.
 23. The method for producing a resinmicroparticle aqueous dispersion according to claim 2, wherein theopening is positioned downstream at a point where a direction of flow ofthe one fluid to be processed is changed to a direction of flow of thespiral laminar flow formed between the both of processing surfaces. 24.The method for producing a resin microparticle aqueous dispersionaccording to claim 3, wherein the opening is positioned downstream at apoint where a direction of flow of the one fluid to be processed ischanged to a direction of flow of the spiral laminar flow formed betweenthe both of processing surfaces.